Taehwan Lee

Experience

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  Seoul Semiconductor

  Jul 2009 - Jan 2010

  Device engineer

  Process Development & Characterization engineering for GaN-based LED-Front-end : Deposition(CVD & Metal)-Back-end : Backside Grinding & Sawing & Electrical Test-PCM management : ACLED(Achrich), Side&Top LED

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  Fairchild - now part of ON Semiconductor

  Jan 2010 - Aug 2016

  Senior Product/Characterization Engineer at Fairchild Semiconductor (Acquired by ONSEMI)

  Senior Product and Characterization Engineer for System(Analog) IC1)The planning and execution of product/process characterization, qualification, and release-to-production with maximized yield and single digit PPM quality.2)Performed full IC characterization, designed process and design experiments, analyzed data and developed products from design into production release with maximized yield and single digit PPM quality.• Performed the full IC characterization - Design for test circuit review - Electrical parameter verification - Absolute maximum verification - Latch up / ESD / Reliability Test - Failure Analysis - Temp characteristic verification - Guard-band test limit setting - Automation bench setup by Labview basis - SPC review and verification for mass production• Product Sustaining engineering Show less

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  Onsemi

  Sept 2016 - Sept 2021

  Staff Product Engineer

  Staff Product Engineer1) Manage all engineering requirements for existing products2) Product owner as the primary person to lead the cross functional teams from internal and external manufacturing and customer. • Work with internal and external groups (design, test, QA, marketing, factory, customers) to resolve issues.• Provide engineering expertise and troubleshooting support for the test, quality, design, internal&external manufacturing team. 3) Cost reduction • Scrap cost reduction by CUM Yield Control and Improvement-FAB & Wafer Sort & Assembly & Final Test• BOM cost reduction for driving device and package qualification for production site transfer.-Fabrication site transfer-Wafer Sort & Final Test site transfer-Assembly site transfer4) Quality Management - Technical support for any quality issue from customer and qualification.• Work with failure analysis (FA) to determine root cause of any qualification failures and customer return -Manage customer returns and make a risk assesement with corrective action• Maintain product data and documentation Experienced products : SMPS PWM(Flyback, Buck, Buck& Boost) IC & LLC IC & LLC with SR , LED Driver with PSR, H/L side Gate Driver, Mixed signal Device with HV BCDMOS(1.2um,0.5um,0.35um,0.18um).Experienced PKG : DIP, LSOP, SOIC,SIP, PQFN(MLP), WLCSP<New Product Engineering>The planning and execution of product/process characterization, qualification, and release-to-production with maximized yield and single digit PPM quality. Show less

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  Hyundai MOBIS

  Sept 2021 - Oct 2022

  Senior Manager

  Responsible for power semiconductor and power Module business planning & development.• Business & quality planning for HMG’s self-developed power semiconductor (IGBT / SiC chip) for E-GMP & EM Platform at xEV• Power semiconductor and Power Module production operation and mid to long-term business operation strategy establishment for HMG`s internalized products.• Collaborate with the semiconductor manufacturing partners to make the eco-system for semiconductor business development in Hyundai Motor Group→ Development and qualification for supplier partner companies (Foundry and Assembly and Test site based on IATF16949) Show less

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  SK 하이닉스

  Oct 2022 - now

  TL - Staff Component Engineer

  Responsible for power component in DRAM & SSD module interface devices(PMIC & Power & Logic device).