John Orrell

John Orrell

Technical Customer Service Manager

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  • Timeline

  • About me

    Sr. Electronics Engineer, Retired

  • Education

    • DeVry Institute of Technology

      1988 - 1988
      ASEET Electronics 3.2

      Finished out ASEET requirements at Columbus State. Based on Tech diploma from DeVry.

    • DeVry Institute of Technology

      1983 - 1985
      Elec. Tech Degree Electronics

      This was my "official" start in the Electronics Industry. I have always had a great interest in electronics, and what I was able to accomplish with this education was far superior to flipping burgers and loading UPS trucks. Over the years, I expanded my education and experience, I am very glad I did so!

    • Franklin University

      1989 - 1994
      BSEE Electronics 3.40/4.0

      GPA 3.20 attending part time.

  • Experience

    • LakeShore Cryotronics

      Jan 1987 - Dec 1996
      Technical Customer Service Manager

      Progressed with multiple positions within Lakeshore. Starting as a production technician 2 years, moving to customer service technician 2 years, technical service manager 3 years, ending in junior engineer.The majority of product worked with involved cryogenic temperature control, and magnetic material analysisGreater detail on my time at Lakeshore Cryotronics is available on request.

    • Eaton Automotive

      Jan 1997 - Dec 1999
      Engineer

      Designed, developed, modified, and maintained Analog / Digital hardware for an On Board Computer as Project and Product Lead Engineer.Led Project and designed new power supplies for cost reduction. This included the design, sim analysis, and development / monitoring of Design Validation Test Plan.Led the redesign of a 386SX based processor to increase Flash and DRAM memory. This included project scheduling from prototype, through DV build, and production. Provided support to Product Firmware Engineers in order to successfully complete projects.Supported CM Engineering / Production with test documentation, component obsolescence and availability issues as well as cost reduction programs including process improvement and second sourcing.Developed extensive design and test experience related to SAE and ISO standards.Reason for leaving: Impending layoffs/better opportunity Show less

    • Woodward Governer

      Jan 2000 - Dec 2000
      Senior Engineer

      Provided extensive support to the Mechanical Engineering department to ensure proper protection of the electronics assembly against mechanical vibration/shock. Supported MFG by resolving obsolescence, performance, manufacturability issues. Redesigned Electronics and firmware for existing products to improve performance, reliability, and cost margin. Revised circuitry and made recommendations for enclosure changes so that product would withstand +/-15KV Electrostatic Discharges to all surfaces and connections. Revised circuitry and made recommendations for enclosure changes so that product would withstand +/-15KV Electrostatic Discharges to all surfaces and connections. Product operating temperature range was from -40C to 125C. End products included under hood natural gas trim valves, electronic throttle bodies, and engine controls. Revised firmware on PIC16F6xx processor to correct a stepper motor problem which was preventing product shipment.Reason for leaving: Plant shutdown. Show less

    • Qualcomm

      Dec 2000 - Mar 2008
      Engineer

      Took lead and support rolls for a wide variety of heavy truck and industrial products ranging from PXA-255 based Windows CE platforms, low cost environmentally hardened color LCD TFT based user interfaces, as well as a wide variety of communication interfaces for vehicle and industrial communication buses.Worked extensively with off-site corporate development groups and external design houses as well as component suppliers. Highly focused on meeting performance, cost, and time line targets.Supported product development from proof of concept, prototype, Alpha test, Beta test, off-shore production line / test development setup, and production release phases. When needed, worked with component suppliers to reduce cost and resolve reliability issues quickly.Extensive work with PCB/PWB placement and layouts ranging from 2 layers to 12 layers with a special focus on minimizing radiated emissions and board size. Primarily worked with Mentor Graphics Boardstation tools and Orcad based development tools.Microcontrollers designed in included PIC16F6xx, MC908MR32, PIC12F510, PIC10F220. This included Firmware including C based code and Assembler (for PIC 10F part). Developed numerous PIC based boards for product test automation including C based firmware.Extensive analog design work in power supplies and vehicle sensor interfaces including Pspice simulation. Sensors included temperature, magnetic (RPM), hall sensors, and truck battery condition.Worked with global design/development/manufacturing groups in San Diego, Batam, Singapore and China. Most overseas work was for new product release, cost reduction, identifying sub supplier errors. Reason for leaving: Layoff Show less

    • Optimal Technologies (US), Inc.

      May 2008 - Jan 2009
      Senior Hardware Engineer

      Took lead Electronics Engineer position for smart home (load side) user interface/ data networking product, focused primarily on digital systems . UI, and analog system design including AMI/AMR circuits and line powered supply systems.This position was highly goal focused with the intent of beating the odds of meeting milestone dates and product performance requirements.Coordinated the efforts of the Firmware, ID, Mechanical, and Manufacturing groups.Extensive work with color TFT display interfaces both analog and digital.Touchscreen technologies included resistive and projected capacitance interfacesProcessors used in this design included a dual ARM 11, ARM 926EJ (TMS320DM355), ARM 7, and MSP430F2410. Clock speeds up to 800MHz.Memory types included NAND and NOR Flash as well as DDR2 SDRAMSystem interfaces included USB, Ethernet 10/100, PCI/PCIE, IRDA, RS-485, Zigbee, and 802.11NDeveloped C based Hardware abstraction layer for ARM 926 display and touchscreenExtensive attention given to high speed interface trace length matching and termination to ensure reliable operation and FCC class B certification.Developed a 5V DC line referenced power supply for the power measurement circuits and a fly-back AC powered power supply. Developed multiple buck power supplies. Product design provided isolation between 3V3DC for internal use and switched powers of up to 260VACMentoring of Jr. Engineers.Reason for leaving: Company / Department shutdown Show less

    • Dorsett Technologies

      May 2009 - Aug 2009
      Senior Electronics Engineer

      Designed and developed a SCADA/control product for small to medium water treatment facilities and building management applications.The effort covered schematic development, cost and performance driven component selection, and PCB layout.Processors that were designed in were an ARM 7 (NXP LPC2468) and MSP430F5418.Designed digital Interfaces included USB 2.0, Ethernet 10/100, RS-485, RS-232 and I2C, including impedance matching of signal pairs as needed.Designed analog interfaces included 12 bit universal inputs, 12 bit D/A outputs 0-10V, 0-20mA. Analog design also included linear and switch mode power supplies.Schematic and PCB design performed in Altium Designer.Reason for leaving: Three month contract position Show less

    • InZero Systems

      Nov 2009 - Nov 2010
      Senior Electronics Engineer

      Reason for leaving: Hardware department shutdownRedesigned a Power PC based network security device for manufacturability and FCC compliance. This effort included designing and simulating new high speed digital bus terminations and analog power supply filtering.Directed FCC class B testing with an outside testing lab.Performed extensive signal integrity analysis on GMII, PCI, DDR2, USB, and Flash interface using Cadence SigXplorer.Guided PCB layout and routing including matched impedance differential pairs.Coordinated manufacturing and support with three separate Contract Manufacturers.Significant effort put towards alternate part sourcing due to lead times. Show less

    • GE Energy

      Jan 2011 - Apr 2011
      Sr. Electronics Engineer

      Power supply design for an existing high reliability natural gas pipeline pumping system. A complete redesign of the TPS40210 based switch mode power supply was required to reach functionality and reliability requirements. The effort included a new schematic design, Pspice simulation, and a new PCB layout. Developed a high efficiency, high reliability 24V to 40V boost power supply from the ground up. Efficiency exceeded 97% at 40W output, with a peak output of 80W. Power supply was developed for use in a medium voltage wind turbine system.Design and validation included the use of Mathcad, Pspice, electronic loads, and a Tektronix loop analyzer.Developed power supply circuits using analog Pspice simulations, and layouts using Cadence/Allegro tools to validate the design. NFPA 70E related work with systems designed for high voltage isolation. Power isolation included planar transformers, magnetic isolators as well as critical PCB layout.Reason for leaving: Project canceled. Show less

    • Scott Safety (Tyco)

      Jun 2011 - Feb 2016
      Sr. Electronics Engineer

      Design of Analog circuits including power supplies (linear and switching), high accuracy gas sensor circuitry, battery charging circuits (NiMh and Lithium Ion)Design of uC/uP systems using PIC 16, PIC 18, PIC 24, ARM Cortex Mx.Used C language programming for the hardware abstraction layer, and when needed software to verify HW operation.Developed Analog, RF, and digital circuitry needed for LF, HF, and NFC RFID Systems / standards. PIC24 based HF RFID/ NFC reader/writer for accountability systems. Worked with module based Zigbee Mesh radio.Worked on prototype IOT modules for BLE, WiFi Direct, using TI, CEL, and Atmel / MCP SAM series kits.Advanced Altium Designer training plus experience in Schematic and PCB design, MS Office, Mathcad, PSPICE use.Worked extensively to ensure that new products would meet FCC, NFPA, UL, ISO, and intrinsic safety requirements.Product types worked with: Thermal imaging cameras, SCBA fire fighter air packs, communication/tracking systems, including air compressor systems. Show less

    • Sealed Air Corporation

      Jun 2016 - Aug 2017
      Sr. Electronics Engineer

      Designing electronics equipment for industrial systems to measure and dispense chemicals for the wear wash industry..

    • Diversey

      Aug 2017 - Jan 2023
      Senior Electronics Engineer

      Designing product for water measurement (chemically) and designing electronics systems to control the release of detergents and sanitizers for industrial clothing washing/drying and dish washing/sanitization. Measurement technologies include Ultrasonic flow and density (TOF), as well as Spectroscopy/ impedance measurement. UVC based robotics system for hospital bacteria elimination, class 2 medical devices. Designs using Cortex Mx processors with focus on EMI/RFI. Use of Python for programming test hardware for product validation.EHS safety supervisor/procedural development for multiple labs including electronics, chemistry, and mechanical disciplines.All systems are LoRa based IOT systems with Cortex M series processors.Motor control systems for precise dispensing of product into the system to ensure that government required standards are met while eliminating waste. Show less

  • Licenses & Certifications

  • Volunteer Experience

    • Team member with my wife to collect donations and assist in the setup of events.

      Issued by Humane Society, Davie County, NC on Jan 2002
      Humane Society, Davie County, NCAssociated with John Orrell
    • Trained Boxer dogs for theray dog work, including visiting Hospitals etc. to visit patients

      Issued by Therapy Dog International (TDI) on Jan 2008
      Therapy Dog International (TDI)Associated with John Orrell