Keng Kooi Lim

Experience

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  Micron Technology

  Aug 2002 - Feb 2010

  Backend Assembly and Testing Principle Engineer

  Product Lead, working on the memory DRAM and Nand MomoryKey responsible included:- Backend yield improvement, electrical failure analysis, communication with FAB to improve backend yield.

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  IM Flash

  Mar 2011 - Jan 2015

  Fab Manufacturing Principle Product and REL Engineer Lead

  Working on 2D Nand, 3D Nand and the 3D XPoint Memory Products.Product lead, responsible included Product Yield Improvement, Solving REL issue, New Product Qualification, process deviation disposition, training.Awarded Best Product and REL Technical Lead in the company

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  Intel Corporation

  Dec 2015 - Jun 2017

  Fab Product Manager

  Startup new 3D Nand Wafer Fab Manufacturing in Intel Dalian, China. Setup new Fab Product team in the 3D Nand Fab.Solve 3D Nand Product, Yield and REL issue and qualify 3D nand product.

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  Intel Corporation

  Aug 2018 - now

  Director New Product Development

  • Leading Product and TEst organization with groups 40 engineers globally (from USA, China Dalian, Shanghai), with 3 senior managers direct report. • Set up Fab Product Technology Development organization from the green field. Experienced in recruiting and growing world-class teams.• Key responsibilities of the organization are the Sort tape development, Pre and Post Si debug, design validation, Pre-Si simulation, Sort Test Time Reduction, Yield/REL improvement/debugging and product qualification and ramping activities.• Successfully ramping 3 technology nodes, 5 products, 7 test chips in the past 5 years with a good track record help team members, supervisors, companies, and customers success.• Selected as Intel Excellent Manager Award in 2022. Show less