Chia-Ping Su

Experience

• 

  Institute of Physics, Academia Sinica

  Jul 2014 - Aug 2014

  Programmer Internship

  • Reassembly a scanning tunneling microscope.

• 

  National Sun Yat-Sen University

  Jan 2015 - Aug 2016

  Undergraduate Researcher

  Laboratory for electron tomography, department of PhysicsSupervisor: Dr. Chien-Chun Chen• Engineered a MATLAB algorithm that reduced STEM scanning time by 90%, enabling faster 3D electron tomography with improved accuracy.

• 

  National Synchrotron Radiation Research Center

  Feb 2015 - Feb 2015

  Winter Programme of NSRRC

  • The winter school on free electron laser.

• 

  National Taiwan University

  Sept 2016 - Jan 2019

  Graduate Researcher & Research Assistant

  STEM laboratory, center for condensed matter sciencesSupervisor: Dr. Ming-Wen Chu• Investigated the correlation between polarization and strain in heterostructures using STEM-EELS, with potential applications in optimizing stacking materials.• Developed a user-friendly MATLAB GUI for quantitative analysis of atomic-scale STEM images.

• 

  Université Paris-Saclay

  Sept 2019 - Mar 2023

  Doctoral Researcher

  STEM group, solid states physics laboratory (laboratoire de physique des solides)Supervisor: Dr. Alexandre Gloter• Investigated the evolution of ferroelectric domains as a function of thickness using STEM, providing insights into material behavior at the atomic scale.• Explored plasmonic excitations in nanostructured metal oxides via STEM-EELS, comparing results with simulations to drive the development of novel materials.• International collaboration with 3 multidisciplinary teams, resulting in 4 scientific papers and 2 oral presentations. Show less

• 

  Xintec Technology Co., Ltd.

  Aug 2023 - now

  Principal R&D Engineer

  • Achieved a 10% yield improvement by optimizing Through-Silicon Via (TSV) etch profiles in CMOS image sensors.• Successfully transferred etching-related processes from R&D to mass production fabrication for 2 device types.• Led Design of Experiments (DOE) to identify and resolve process bottlenecks, utilizing SEM, AFM, and FT-IR for failure analysis.• Spearheaded the evaluation of cutting-edge etching tools and testing methodologies, including plasma dicing for stacked wafer and ultra-thin die shear testing. Show less