Ashwin Ramani

Experience

• 

  Tessolve

  Feb 2012 - May 2017

  PCB design engineer

  designed mother boards,application boards,support cards for leading mobile SOC manufacturer.worked on DDR,EBI,PCIE,HDMI,USB,SATA,MIPI CSI - DSI,PMIC,RFFE,I2C,MISO technologies.Designed boards from schematic to gerber stage as per IPC ,UL and IEC spec.Performed preliminary cam checks with CAM 350.Worked with layout guidelines for reduced emi.

• 

  Sienna ECAD Technologies Private Limited

  Jun 2017 - Oct 2018

  PWB design engineer

  designing PWB board solutions forembedded ,IOT and wearable product engineers

• 

  Qualcomm

  Oct 2018 - now

  -Developing optimum Layout breakout strategies for R&D Teams.-Developing Layout design strategies to set best possible PDN targets and Signal Integrity targets.-Closely working with Package and Physical design teams to optimize device pinouts -Designing PWB from Placement till Manufacturing stage.-working closely with inter departmental teams like Mechanical, Component Engineering, Signal and Power Integrity Team.-Valor and QA checking.-Communicating with FAB vendors regarding stack up , manufacturing queries.-Contributing towards CAD tool enhacements, process improvements.

  • Lead pwb design engineer

    Nov 2022 - now

  • Sr PWB design engineer

    Jul 2020 - now

  • Sr PWB design Engineer

    Oct 2018 - Jul 2020