
Dr. Jinto George SMIEEE
Lecturer in Electronics

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About me
Senior Program Manager at RoshAi Pvt. Ltd.
Education

Mahatma Gandhi University
1997 - 2000B. Sc. ElectronicsActivities and Societies: National Service Scheme (NSS)

Bharathidasan University
2000 - 2002M.Sc. Electronics
Université de Sherbrooke
2017 - 2018Post Doctoral Degree in Advanced Research - Scientific Career in an Industrial Environment Microelectronics Engineering.webp)
Munster Technological University (Cork Institute of Technology)
2008 - 2016Doctor of Philosophy (Ph.D.) Electronic EngineeringActivities and Societies: IEEE CPMT & IMAPS
Experience

Ilahia College of Arts & Science
Oct 2002 - Jun 2005Lecturer in Electronics• Instructed courses and conducted laboratory sessions for both undergraduate and postgraduate students.• Provided guidance for final-year student projects and seminars.• Served as the class advisor for final year undergraduate students.• Held a position as a Board of Examination member at MG University, Kottayam, Kerala, India.

Cochin University of Science and Technology
Jul 2005 - Feb 2008Design and Development of Data Storage Archival Tag for studying Migratory Pattern of Tuna FishDesign & Development:• Design of Data Storage Archival Tags with various sensors for Monitoring Tuna Fish.• PCB Design using OrCAD and Fabrication of PCB.• Selection of suitable SMD components for assembling the miniaturized Tags.• Programming and Interfacing of Microcontrollers and various sensors using the appropriate protocol.• Creating an algorithm for estimating geolocation.• Testing and conducting trial runs on the assembled modules. Show less
Senior Research Fellow
Jul 2007 - Feb 2008Junior Research Fellow
Jul 2005 - Jun 2007

Nimbus Centre, Cork Institute of Technology
Mar 2008 - Mar 2016Graduate Research StudentThesis Title:- A Plastic Encapsulated Wireless Sensor Module for Monitoring of Medical Steam SterilizersResearch: • Characterization of different organic substrates under various temperature and humidity environments.• Evaluation of different encapsulants under various temperature and humidity environments.• Reliability evaluation of encapsulated modules which contain electronic sensors, active & passive components (COTS) and coin batteries in various conditions (HAST, PCT, THB, TCT, TST).• Finite Element Modelling (Ansys) for Thermo-Mechanical Stress and Hygro-Mechanical Stress, Design of Experiments (Minitab), FMEA.• Design (AutoCAD) and Fabrication (3D Printer) of moulds for encapsulating electronic devices.• Design of Wireless Sensor Module, PCB design (OrCAD) and fabrication, SMD assembly.• C and Assembly programming for microcontrollers.• Interfacing of temperature sensor, pressure sensor, humidity sensor to microcontroller using I2C, SPI, RS232 protocols.• Hands-on experience in PCB milling machine, 3D printer, SMD assembly station, Humidity chamber, Medical Sterilizer, Shear tester, Reliability testing and analysis, etc.• Collaboration with Tyndall National Institute, Cork, Ireland for reliability testing via National Access Programme (NAP) funded by Science Foundation of Ireland.• Write research articles and present in conferences.Outcome: Three IEEE journal papers, two conference papers (IEEE & IMAPS) and two postersRecognition: Student paper award from IMAPS USA and poster award from CIT, Ireland Show less

Nimbus Centre
Dec 2009 - May 2010Hardware EngineerProject title: Remote Monitoring Platform for Performance Assessment of Geothermal Heating SystemsDesign & Development:* Three phase power meter* Wireless temperature sensor module * Flow meter interface to main module* Base station with GSM moduleTools: OrCAD, Arduino IDE, Atmel Microcontrollers, ZigBee modules, Digital temperature sensors, current sensors, flow meter, GSM module etc..

Université de Sherbrooke/IBM Bromont
Jun 2016 - Aug 2020Post Doctoral Fellow• Experience in Advanced Packaging Process for Compound Semiconductors.• Development of Interconnecting Method for CdZnTe Sensor Device.• Development of wire bonding process on GaN devices.• Development of Au stud bumps on Photonic ICs, Si dies, Organic Substrates.• Developed Low Temperature Interconnection Process for 3D Packaging.• Expert in Flip-chip assembly, Screen Printing, Die Attach, Underfill process, etc.• Development of Protocol for material selection.• Hands-on experience in material characterization instruments: Rheometer, DSC, DMA, TMA, TGA, Dage Bond Tester, Instron, Four point probe, XYZ optical microscope, Keyence 3D Microscope, Altimet 3D Optical Profilometer, dicer, polisher, etc.• Reliability Tests: Temperature/Humidity Storage Test Temperature Cyclic Test, HAST, etc.• Prepare work plan, experimental method and present results in team meetings & high-level management meetings.• Collaborated project with Redlen Technologies British Columbia, TeraXion Quebec, GaN Systems Ontario and CMC Microsystems Canada• Supervising project students.• Write research papers and present in conferences.* Outcome: 1) IEEE conference paper (ECTC 2019 Las Vegas, US) 2) Contribution to an IEEE journal paper* Recognition : IEEE Certificate of Achievement from Electronic Packaging Society (IEEE EPS), RQEMP Summer School 2019 poster award Show less

Nirmala College, Muvattupuzha - 686 661
Jan 2021 - Sept 2021Assistant Professor (Contract)• Instructed coursework and supervised laboratory sessions for undergraduate students.

Intrans Electro Components Pvt Ltd
Oct 2021 - Jun 2023Head, Design & Development• Lead departmental operations such as design, cost estimation, development, and review processes.• Facilitate seamless collaboration with departments: Marketing, Planning, Purchase, Production, and Testing.• Manage the preparation and submission of documentation required for BIS licensing.• Craft proposals for the creation of innovative products.• Engage in technical dialogues with customers.• Provide technical assistance to the Customer Service Team.

RoshAi
Jan 2024 - nowSenior Program Manager
Licenses & Certifications

WHMIS
- View certificate

IEEE Electronics Packaging Society Level 1 Certificate
IEEEJan 2019 - View certificate

Achieving High Reliability for Lead-Free Solder Joints - Materials Consideration
IEEE Educational Activities CertificatesNov 2018 
Embedded Computing for IoT Systems
IEEE Blended LearningSept 2018
TSV and FOWLP Reliability Challenge Overview
IEEE Educational Activities CertificatesDec 2018
Flip Chip Interconnection and Its Application
IEEE Educational Activities Certificates
Honors & Awards
- Awarded to Dr. Jinto George SMIEEEThird Position in RQEMP Summer School 2019 Poster Competition RQMP Student Chapter, Quebec, Canada Jul 2019
- Awarded to Dr. Jinto George SMIEEEElectronics Packaging Society Certificate IEEE EPS Jan 2019 IEEE Certificate of Achievement from Electronics Packaging Society (IEEE EPS) during ECTC 2019 at Las Vegas, US
- Awarded to Dr. Jinto George SMIEEEThird Position in Postgraduate Student Poster Competition Cork Institute of Technology, Cork, Ireland Mar 2012
- Awarded to Dr. Jinto George SMIEEEStudent Paper Award International Microelectronics Assembly and Packaging Society (IMAPS), USA Jan 2012
- Awarded to Dr. Jinto George SMIEEEResearch Grant Science Foundation of Ireland Sep 2011 Research grant from Science Foundation of Ireland through National AccessProgramme (NAP) at Tyndall National Institute for the project entitled “Non–Destructive Reliability Analysis of Electronic Packaging for Sterilisable Electronics” (NAP359: http://www.tyndall.ie/nap/successful_proposals) September 2011.
- Awarded to Dr. Jinto George SMIEEEPhD Scholarship Higher Education Authority, Ireland Mar 2008
- Awarded to Dr. Jinto George SMIEEEFirst Rank in M. Sc. Electronics Examination 2002 Bharathidasan University, Trichy, Tamilnadu, India Apr 2002
Languages
- enEnglish
- maMalayalam
- taTamil
- frFrench
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