Rithika Manchikatla

Experience

• 

  SAEINDIA-SNIST

  Jan 2016 - Jan 2018

  Documentation Head & Active Member

  Been part of the Board of Members of SAEINDIA-SNIST, serving as Documentation Head for the tenure 2017-18. Been an Active Member of the club from 2016-2018. Worked in two projects: VKC 2017 and BAJA 2018. Also organised workshops and volunteered in events as part of the club. Mentored juniors in business plan presentations and documentation.

• 

  Advanced Training Institute

  May 2018 - Jun 2018

  Summer Trainee

  Trained in three courses:1. Lean Manufacturing2. Shielded Metal Arc Welding3. Pneumatic Controls

• 

  MIDHANI

  Jan 2019 - Apr 2019

  Winter Project Intern

  Worked on developing a Tungsten based Maraging Steel for HAPP for the application of Fin Stabilised Armour Piercing Discarding Sabot.Evaluated material properties such as hardness and tensile strength on vickers hardness testing machine and ultimate tensile testing machine respectively.Studied microstructure, grain size of W-alloy by optical microscopy to cut down the cost and weight of using tungsten carbide for APFSDSDetermined inclusions present in W-alloy by scanning electron microscopy and examined phase transitions in W-alloy by differential scanning calorimetryProjected range of percentage reduction in sulphur before and after electro-slag re-melting of a maraging steel by linear regression analysis Show less

• 

  University of Illinois at Urbana-Champaign

  Jan 2020 - Mar 2021

  Studying the magnetic properties of a Cu-Ta-Nb-O system (Cu2(Ta,Nb)2O6). I aim to observe the magnetic interactions between the copper atoms (Cu 2+) in the trirutile structure by the substitution of Tantalum (Ta 5+) and Niobium (Nb 5+). The Molar concentrations of the Ta, Nb must be 2. I plan on varying the individual molar concentrations of Ta and Nb (e.g (Ta=0.2 mol, Nb=1.8 mol); (Ta=0.4 mol, Nb=1.4 mol); so on) to observe the formation of the structure and also its effect on magnetic interactions with these changes. Show less

  • Graduate Research Assistant

    Sept 2019 - Mar 2021

  • Graduate Student

    Aug 2019 - Mar 2021

  • Graduate Teaching Assistant

    Aug 2020 - Jan 2021

  • Graduate Teaching Assistant

    Jan 2020 - May 2020
• 

  Micron Technology

  May 2020 - Aug 2020

  Process Engineer

  • Performed statistical analysis on thickness data to understand the discrepancies of uneven film thickness across different chambers in the tool on JMP software• Conducted ‘Design of Experiments’ to improve the process ‘In-situ Steam generation’ for better film thickness and device performance on whole for the 3DX point technology• Designed a sophisticated way to create and process ‘special work requests’ across the department to keep track of the process changes, process parameters and research developments of a product wafer. Show less

• 

  Intel Corporation

  Mar 2021 - now

  Quality Reliability R&D Engineer

  Defined and executed de-risk strategy for assembly test interactions with various package architectures through collaboration with a multi-disciplinary engineering team, to achieve on time certification of test process• Performed technical assessment and FMEA during product intake, and used it to influence prototype design and test coverage, define de-risk strategy and key program decisions, and develop an initial qualification plan• Designed down-selection experiments based on physics of failure mechanisms and key process modulators• Led response to quality baseline shifts by applying commonality analysis and MBPS to drive root cause findings and utilized 8D methodology to update process targets, control plans, and manufacturability improvements• Drove experiments to assess and mitigate potential manufacturability issues for tester IC package interactions and developed qualification strategy to enable HVM tester deploymentDefined and executed integrated reliability de-risk strategy and characterization of new advanced packaging technologies to demonstrate feasibility and robustness prior to product alignment• Designed fundamental Optical Integrated Interconnect thermo-mechanical experiments to drive technology resiliency by optimizing design and materials for reliability• Collaborated with multidisciplinary team to develop test methodology for photonic integrated circuit by using FMEA to identify IC testing gaps, designing experiments for test validation, and developing a soft bin strategy• Performed FMEA for Next Gen Foveros Direct technologies, driving early process characterization, and working with stakeholders to establish initial process targets, quality models, metrology plan• Applied physics of failure to model and identify potential intrinsic reliability limiters, and drove building block experiments to identify optimal material and design parameters, and characterize process modulators Show less