David Green

Experience

• 

  IBM Corporation

  Jan 1981 - Jan 1993

  Advisory Engineer

  Dry Etch equipment and process engineering for both high volume manufacturing and leading edge development pilot line. Technologies included bipolar, CMOS, and DRAM.

• 

  Motorola

  Jan 1993 - Jan 2000

  Led team which reduced yield loss from GaAs etch operation. Developed and characterized processes for BiCMOS/SMOS pilot production. Mentored etch engineers on defect reduction and process centering continuous improvement. Defined and qualified RF discrete process flow for transfer from closing fab to receiving fab. Managed group of engineers/technicians for new fab start-up, qualification, and sustaining. Recruited and hired engineers; issued annual performance reviews. Evaluated and selected dry etch equipment for advanced product requirements.

  • Etch / CMP Process Engineer

    Jan 1996 - Jan 2000

  • Etch Process Section Manager

    Jan 1993 - Jan 1996
• 

  Freescale Semiconductor

  Jan 2000 - Jan 2006

  CMP Group Lead/Process Engineer

  Optimized processes and consumable lifetimes to reduce operating costs. Developed and implemented new clean processes. Led continuous improvement team which reduced polish defectivity. Qualified high throughput polisher for high volime manufacturing. Developed and implemented tool qualification procedures and advanced metrology for defect monitoring. Company wide scrap reduction and GMP implementation champion.

• 

  Qimonda

  Jan 2007 - Mar 2009

  Yield Improvement / Defect Reduction Engineer

  Coordinated and drove etch group defect reduction continuous improvement activities. Assisted PLY, product and process integration engineers on excursion events.

• 

  IM Flash Technologies

  May 2010 - Nov 2019

  Process Integration Engineer
• 

  Micron Technology

  Nov 2019 - Oct 2021

  Process Integration Engineer
• 

  Texas Instruments

  Nov 2021 - now

  Process Development Engineer