Hua Kuan Low

Experience

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  Nanyang Technological University Singapore

  Jul 2020 - Jul 2021

  NTU URECA Programme

  Project: Cradle-to-Gate Life Cycle Analysis of Primary Packaging of PharmaceuticalsSupervisor: Assoc Prof Kunn Hadinoto Ong • Designed LCA on two different drug packaging in OpenLCA software to determine environmentally friendly aspects utilizing CML-IA baseline assessment method.• Produced a research paper on result PVC blister is 70% environmentally preferable to Aluminium blister packaging.• Awarded Certificate of Merit as a NTU President Research Scholar.

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  Bosch

  Sept 2021 - Nov 2021

  Market Research for a Robotised Solution for E-waste (RebotX - Recycling Robot)

  • Worked together with 8 team members under guidance of Bosch Research Scientists to perform market research and provide insights from interviews with facility managers and potential customers• Evaluated current e-waste management technology, proposed and identified potential customers and business model to ensure Bosch can work with on robotised solution • Allowed companies to have cost-effective and eco-friendlier approach for developing new business models.• Presented findings to Bosch representatives and was met with approval Show less

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  BAT

  Jan 2022 - May 2022

  Project Engineering Intern

  • Revamped People Leave and Schedule Management System – Cloud Based with Power Automate, Excel VBA and Microsoft Office, reducing process time by 50%.• Involved in cross-team collaboration to brainstorm and elicit requirements in designing a new data collection method with Excel VBA to efficiently handle daily production data from various departments.• Conducted training for technical operators and provided guidance in using new data entry system.• Automated manual Certificate of Analysis production that took 5 hours per week to 20 minutes per week with UiPath.• Accelerated data cleaning and transfer for Infestation report production 15 times faster using Power Query and Excel VBA• Collaborated with Department Managers and Automation Engineers for quality inspection automation of bundles and packs packaging in manufacturing line. Show less

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  United Microelectronics Corporation (UMC)

  Jun 2023 - now

  Process Engineer