Shivani Salian

Shivani Salian

Embedded System Engineer

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location of Shivani SalianVillach, Carinthia, Austria

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  • Timeline

  • About me

    Master Thesis student @ Infineon Technologies | Msc @ TU Hamburg (Microelectronics and Microsystems) | Specialization in Semiconductor Process Technology

  • Education

    • Hamburg University of Technology

      -
      Master of Science - MS Microelectroincs and Microsystems
    • University of Mumbai

      -
      Bachelor of Engineering Electrical and Electronics Engineering

      Activities and socitites: Electronics Engineering Student association(EESA)

  • Experience

    • Drona Aviation Pvt. Ltd.

      Jun 2018 - Jun 2019
      Embedded System Engineer

      ● Integrated a nano drone flight controller with an additional power converter circuit topower brushless motors for Macro Drone.● Assembled, Calibrated and performed PID tuning to optimise flight performance.● Designed and implemented a supporting structure using SolidWorks for the latchingmechanism.● Developed and coded the latching mechanism control using the company's IDE andinbuilt APIs.

    • Hamburg University of Technology

      Oct 2021 - Jan 2022
      Tutor - Microsystems Engineering

      ● Facilitated weekly problem-solving sessions for a class of 40 students, guiding themthrough assignments.● Conducted weekly meetings to address questions, resolve doubts, and prepare forweekly presentations.

    • Hamburg University of Technology

      Aug 2022 - Mar 2023
      Project Arbeit

      ● Brainstormed and Developed a novel concept for a MEMS device capable of bothdetection and permanent storage of events upon crossing a threshold limitmechanically.● Simulated deflection path and bending limits of the cantilever beam under variousstructural configurations and deflection forces through FEM simulations.

    • Bosch Manufacturing Solutions

      May 2023 - Oct 2023
      Intern

      ● Planned, Executed and Evaluated test series for plasma-assisted deposition ofdiamond-like carbon coatings.● Performed extensive characterisation of DLC coatings: Analysis of layer Adhesion byRockwell Penetration tests and Scratch tests, determination of Mechanical propertiesby Nanoindentation, and Residual Stress (Light Scanning Microscope).● Created analytical models for the optimization of process parameters for material modelling

    • Infineon Technologies

      Mar 2024 - now
      Master Thesis Student

      ● Performed an in-depth analysis of a power MOSFET device to assess the influence of bond pad metal film, barrier layers, and substrate thickness on the chip bow. ● Leveraged DOE method to optimise the process flow based on analysis results ● Built a predictive model to evaluate bow across device parameter combinations. ● Plannned experiments to analyse warpage in 3D contact holes, and vias, optimising the impact of trench dimensions and various fill metals.● Generated Ansys-based material models to model and predict the behaviour of fill metal in High aspect ratio vias and contact holes. ● Interacted with cross-functional process and process development & integration teams to collaborate on multiple projects. Show less

  • Licenses & Certifications

    • Lean Six Sigma Foundations

      National Association of State Boards of Accountancy (NASBA)
      Sept 2024
    • Introduction to Ansys Mechnical APDL Scripting

      Ansys
      May 2024
  • Honors & Awards

    • Awarded to Shivani Salian
      Merit scholarships financed from sources of the Free and Hanseatic City of Hamburg (BWFGB). Free and Hanseatic City of Hamburg Aug 2022 A scholarship for excellent academic achievements in the year 2022.