Teppo Aapro

Experience

• 

  Nokia

  Jan 1997 - Jan 2014

  • Thermal design and simulations of phones; e.g. LUMIA 1520, 630, 620, 920, 925, NOKIA 701, 808. • HW & SW thermal management / cooling technology development. • Technology supplier co-operation.• Component and module thermal simulation model development with key suppliers. Requirements, design targets, reviews. • Joint R&D thermal design process program support and result reviews. • Development of thermal simulation methods, e.g. wireless charging. • Leading thermal specialist network within Nokia.• Thermal simulation tools. Show less • Thermal design and simulations of phones, e.g. NOKIA N8, 2720, E51, E52.• Thermal management / cooling technology development. Technology supplier co-operation.• Component and module thermal simulation model development.• Chipset thermal analysis, simulations, product implementation support.• Joint R&D thermal design process development; target setting and requirements, training and piloting, program support and result reviews. • Leading thermal specialist network within Nokia.• Development of thermal simulation methods.• Thermal simulation tools.• Thermal training within Nokia. Show less • Research projects focusing on novel thermal management solutions for telecom network basestation, rack & server electronics; new cooling technologies feasibility analysis, development of thermal simulation methods, development of thermal testing, experimental verification and implementation guidelines with using real product case studies.• Research projects focusing on novel thermal management solutions for mobile devices; thermal management technology sourcing, new thermal management materials feasibility evaluations, development of thermal material testing, thermal characterization and benchmarking, product implementation. • EU Research Projects, “KHIEPCOOL” (FP4-BRITE/EURAM 3) and “PROJECT M3” (FP5-GROWTH), focusing on novel liquid cooling methods for electronics. • Development of simulation methods for IC components, HW modules, PCB and system level.• Development of virtual design process (thermal area).• Development of simulation methods for thermal & EMC concurrent simulation.• Development of simulation methods for fuel cells.• Thermal simulation tools.• Thermal training within Nokia. Show less

  • Principal Specialist, Thermal Management

    Jan 2010 - Jan 2014

  • Specialist | Senior Specialist, Thermal Management

    Jan 2007 - Jan 2010

  • Nokia Research Center - Research Engineer | Senior Research Engineer

    Jan 1998 - Jan 2007

  • Nokia Research Center - M.Sc. Thesis Worker

    Jan 1997 - Jan 1998
• 

  Microsoft

  Jan 2014 - Aug 2016

  Principal Specialist, Thermal Management

  • Thermal design and simulations, e.g. LUMIA 950XL, 950, 640XL• Heat pipe (liquid) cooling module thermal design and implementation (LUMIA 950XL). • HW & SW thermal management / cooling technology development. • Technology supplier co-operation.• Component and module thermal simulation model development with key suppliers.• Development of thermal simulation methods, e.g. fast USB charging.

• 

  Huawei Technologies

  Sept 2016 - Jul 2018

  • Principal Engineer, Thermal Simulations | Consultant, Reliability Competence Center

    Jan 2018 - Jul 2018

  • Expert, Thermal Design | Consultant, Terminal Thermal Team

    Sept 2016 - Dec 2017
• 

  Varjo

  Mar 2019 - Dec 2019

  Simulation Specialist
• 

  Murata

  Jun 2020 - now

  Component Platform Specialist