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HyunJong Oh

HyunJong Oh

Followers of HyunJong Oh169 followers
location of HyunJong OhSan Francisco Bay Area

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  • Timeline

  • About me

    Amkor Technology의 Technical Program Manager

  • Education

    • 국민대학교

      -

    • 국민대학교

      1993 - 2000
      학사 금속재료공학과

  • Experience

    • Amkor Technology, Inc.

      Jun 2012 - now

      2000.12~2007.06Wafer Saw / Die Attach Process Eng'r -. Thin Wafer Handling Development-. Low K Wafer Sawing Method Development-. Low K Wafer _ Die Attach Development-. Pad damage during wafer sawing improvement2007.07~2008.06-. 3 Tier Wire Bonding Development-. Long Loop Wire Design Support -. Wire Sweep sensitive device support2008.07~2009.04 -. Flip Chip CSP PKG chip attach support.2009.04~2011.12-. Fine Pitch flip chip attach using thermal compression development2012.01~ -. TSV PKG Development using thermal compression process Show less

      • 수석, Sr director

        Jul 2014 - now

      • Director

        Jul 2014 - Jul 2014

      • Sr Manager

        Jun 2012 - Jun 2014

  • Licenses & Certifications