Trevas Chen

Trevas Chen

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location of Trevas ChenLos Angeles, California, United States

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  • Timeline

  • About me

    Space Electronics Products Design Engineer at Boeing

  • Education

    • Rensselaer Polytechnic Institute

      2017 - 2021
      Bachelor of Science - BS Aerospace, Aeronautical and Astronautical Engineering 3.59/4.0 (Overall)

      Senior at RPI studying aeronautical engineering.

    • Bronx High School of Science

      2013 - 2017
  • Experience

    • Rensselaer Polytechnic Institute

      Aug 2019 - Dec 2019

      Educated 140+ undergraduate students for 8 hours per week on modeling, drafting, and assembly practices using Siemens NX as well as creating orthographic hand drawingsProvided comprehensive feedback on students’ homework assignments and final project Researched shock tubes and shock tunnels to run supersonic and hypersonic flow experiments.Researched the effects of boundary layers on small diameter shock tubes.Looked into the manufacturability of 1 cm diameter shock tubes.

      • CAD Teaching Assistant

        Aug 2019 - Dec 2019
      • Research Assistant

        Aug 2019 - Dec 2019
    • Actasys

      Jun 2020 - Jan 2021
      R&D Engineering Intern

      Manufactured synthetic jet actuators built from different types of fiberglass composites with different types of integrated piezoelectric discsAutomated the performance characterization of synthetic jet actuators which decreased testing time by 89% via a Python script, National Instruments Data Acquisition unit, pressure transducer, and laser vibrometerAdapted and applied academic research concepts and designs such as waveform manipulation and cavity geometry to create improved prototype actuators to meet company target goals of increased performance and decreased noise outputTrained four additional team members to fabricate and characterize synthetic jet actuators prototypesDesigned manufacturing jigs for aligning piezoelectric discs in SolidWorks improving performance by 12% and improving repeatability of the manufacturing processDocumented the entire manufacturing procedure with pictures, videos, and a report for future employees Show less

    • Boeing

      Oct 2021 - now
      Space Electronics Products Design Engineer

      Conducted metal fab hardware reviews and electrical slices reviews and dispositioned discrepancies found in NCRs and MRB packages.Designed electronic enclosures for satellites and aircraft and test fixtures for electronic components using CREOAutomated the cross-checking processes of CREO BOMs and Teamcenter BOMs using a VBA scriptPerformed unit-level and electrical slice-level structural analysis using ANSYS and provided recommendations to reduce deflections and lower the risk of solder joint failures Show less

  • Licenses & Certifications

    • STK Level 1

      AGI (Analytical Graphics, Inc.)
      Mar 2021
  • Honors & Awards

    • Awarded to Trevas Chen
      Western Digital Scholarship Western Digital Sep 2019
    • Awarded to Trevas Chen
      Dean's Honor List Rensselaer Polytechnic Institute Sep 2017