Lee Kin Nan

Experience

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  Renesas Semiconductor KL Sdn.Bhd.

  Aug 2010 - Sept 2011

  Process Engineer

  Designation: Encapsulation Junction Process Engineer Job Function: Process yield stability and quality issueI. General responsibilities are process yield control and quality control for semiconductor QFN, SOP, SSOP and LQFP packages. II. Encapsulation and PCM oven machine parameter optimization. III. Process yield improve by engineering tools of 6-sigma, process CpK, SPC & FMEA. Outcome upon completed:A. Successfully improve SSOP moulding CpK value achieved 1.67 from 1.00B. Able to decrease LQFP package moulding defects by 1% by trouble shooting the moulding temperature and speed failure. Project Function:I. Handle encapsulation resin storage and transferring time efficiency project setup. The resin storage and transfer time is design to link with system programming, so as to auto record information and trigged alarm for expired issue. Project work out for 0.5 of progression. Show less

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  Skywork Panasonic Filter Solution Singapore

  Dec 2011 - May 2015

  Technology: Wafer Fabrication back end process -- Electroplating & Sputtering Main on project and settle daily quality issue:I. Process owner of electroplating and sputtering process. Handle the overall technology transferring project from Panasonic Headquarters Osaka to Singapore. a. Project learning duration is 9 weeks follow up with project set up duration is 7 weeks.b. Overall process set up of documentation includes SOP, process control plan and process FMEA/PFMEA, FTA, chemical safety operation instruction, Alteration Quality 1 & 2 for pre-production and mass production.c. Overall process manufacturing and quality testing chemical ratio including Copper, Nickel & Black Nickel electrolysis mixing ratio. Overall process 14 chemical test for quality control and 30 types manufacturing chemicals. d. Handle on process yield improvement and process capability stability. By engineering tools DMAIC, 6-sigma, process CpK value, DOE and 8D-CAR to analysis, measure, trouble shooting, yield improvement and finally maintain yield stability.Outcome upon stability:A. Successful setup CSP 2 process line in Panasonic Singapore with significant yield improvement from average yield 70% (Panasonic Japan HQ) to average yield 98% (Panasonic Singapore) for electroplating and sputtering process. Overall CSP2 yield rate is 90%.B. Successful handle panels broken project for electroplating and sputtering process with improve average yield rate and outlier of occurrence.C. Successful built in external chemical testing internally to cost reduction by DOE (Minitab) engineering tools. Significant impact saving per month. Show less Products/Technology: Wafer Fabrication (Wafer Dicing & wafer mounting process) Job Function: 1. Process owner of wafer dicing process. Handle overall dicing process yield improvement, chips side face and surface quality control.2. By engineering tools of failure tree analysis (FTA), DOE, Analysis of variance (ANOVA), t-test and f-test to figure out the wafer dicing defects root cause.3. Work closely with equipment engineers and Disco machine vendors to understand the machine functions and spare parts design.4. Familiar to parameters in both Single and Dual dicer (DFD#6340, 6341, 6240).5. Work out flange conditioning method to equipment engineer, so as to maintain the blade cutting performance. 6. Work out dicing UV Tape and UV machine to cost reduction and production UPH improvement. By the same tape achieved yield improvement.7. Work closely with Japan support engineer in dicing blade cutting mechanism. Figure out the blade diamond grit size, concentration, and blade RPM, feed speed, spindle current, water pressure, flow rate flange movement and chuck table vibration condition. Outcome upon yield improved:I. Successfully achieved yield improvement after 1 year effort. Average yield improved from 93% to 97%. Achieved significant improvement.II. Successfully cost reduction by using dicing UV tape and UPH improvement.Management Experience: 1. Lead wafer dicing process team with 3 shift assistant engineer, 1 normal shift engineer and 1 failure analysis assistant.  2. Arrange and lead team meeting on daily dicing failure issue.  3. Team creates VBA macro to gather and analysis data from dicing machine. Show less

  • Process Engineer

    Dec 2011 - May 2015

  • Process Engineer

    Dec 2011 - May 2015
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  ENPLAS CORPORATION

  Aug 2015 - Jun 2016

  Senior Technical Sales Engineer

  Products/Technology: Optical Fibre Communication (Focus on Injection molding optical products quality and business development) Job Function: 1.Responsible for all OEM and ODM optical lens quality issue. Discuss with OQA team for problem solving method and explain to customer the solutions & future prevention method by QC tools and machanical drawing. 2.OEM lens include 8/10/16G Transmmiter & Reciever lens, Bi-directional lens and Active optical cable (SFP, SFP+, QSFP lens).3.ODM product include Tosa and Rosa lens barrel, LC plastic barrel, standard SC barrel and others.4.Responsible for ODM&OEM parts market development. Analysis market distribution by monthly sales amount and competitor market share.5.Responsible for market trend up and down condition. Focus on customers feedback regarding quality issue, pricing and competitor information. 6.Responssible to monthly sales forecast based on customer demand status, quotation and products quality concern. 7.Main focus on China market, travel to China (Shenzhen, Shanghai & Wuxi) for market information gathering and customer quality issue feedback.8.Current related customer include China Hisense, HiOptel, PCL,Shunsin, Finisar Malaysia Technocom, Philippines Amertron and Thailand Viavi & Lumentum. Show less

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  Saint-Gobain Abrasive

  Jun 2016 - now

  Regional Senior Product Engineer - (SEA)

  1. Responsible for regional market products quality performance & new business development. 2. Focus on South East Asia semiconductors, hard disk drive, storage drive, LED, Solar & Signal filter electronics devices industries. 3. Main focus on SEA market (Thailand, Malaysia, Philippines & Singapore) for business development, market analysis & products development. 4. Professional in wafer back-grinding wheel, dicing blade, wafer Edge grinding/polishing wheel & diamond wire cutting products design & process function. 5. Work closely with R & D team engineers in USA to develop new abrasive products to achieved customer process CpK and 6-sigma value. 6. Work together with end customers or distributor to develop the new products or optimize the function of the existing products. To make sure fully utilized the products to fulfilled customer cost reduction & process yield percentage. 7. Provide after sales monthly customer plant visiting service to maintain good relationship with customer & discussion the product quality performance. Outcome Upon business development:1. Successfully get new business conversion for 3 new customers, which bring new potential sales to company approximate USD 200K/annual Show less