
Timeline
About me
Process & Equipment Engineer at INTEL PRODUCTS VIETNAM CO. LTD
Education

Ho chi minh city university of technical education
2003 - 2008Bachelor's degree mechatronics, robotics, and automation engineering a
Experience

Intel technology malaysia
Oct 2008 - Nov 2009Process engineer - eit at intel technology malaysiaDesign and run DOE (design of experiment) to define process parameters. Develop and qualify for new equipment for new process. Learn, apply statistical knowledge to qualify, stabilize new process (Cpk, control chart, monitor set...) Learn, apply development methodology, terminology to transfer new process to HVM (high volume manufacturing) be ready to start up Intel Products Vietnam

Intel products vietnam co. ltd
Nov 2009 - nowProcess & equipment engineer - assembly new product integratorProcess and equipment Engineer – ASM ball placement machine expert, SOC BA EIT leader be accountable for SOC and product transfer, responsible for tool upgrade and install qualification, the process/equipment to improving and maintaining the overall performance in term of safety, yield, quality and equipment performance to ensure the product reliability & productivity to meet the business goal. Continuous improve process and machine performance to increase run rate and eliminate waste in process. Currently working as Assembly New Product Integrator (NPI) be accountable for coordinate and planning new SOC product transfer to Intel VietnamTool install and qualification leader:July 2013 to Dec 2013: EIT 6 months in Intel Malaysia to learn to transfer SOC product to Intel Malaysia which totally new to current process. This product applied new pick and solder ball technique where require more accuracy due to small form factor. After 6 months on job training, new product and new process transfer flawlessly to production. Oct 2012 to Jan 2013: EIT 3 months in Intel Chengdu to catch up and transfer new Flux printing technology which apply for new chipset platform which deploy to product in Vietnam. Dec 2010 - Jan 2011: module team leader transfer new chipset product from Intel ChengDu China to Intel Viet Nam, new link install and product qual successfully deliver best production line to manufacturing 2 week ahead schedule. Show less
Licenses & Certifications
- View certificate

A3 problem solving for continuous improvement
LinkedinNov 2020 - View certificate

Lean six sigma: define and measure tools
LinkedinApr 2021 - View certificate

Six sigma foundations
LinkedinMar 2021 - View certificate

Operational excellence foundations
LinkedinFeb 2021 - View certificate

Leveraging generative ai for project management
LinkedinAug 2024 - View certificate

Jeff dyer on innovation
LinkedinOct 2019
Languages
- enEnglish
- viVietnamese
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