Mai Van Hoa Binh

Mai van hoa binh

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  • Timeline

    Oct 2008 - Nov 2009

    Process Engineer - EIT at Intel Technology Malaysia

    Intel Technology Malaysia
    Current Company
    Nov 2009 - now

    Process & Equipment Engineer - Assembly New Product Integrator

    INTEL PRODUCTS VIETNAM CO. LTD
  • About me

    Process & Equipment Engineer at INTEL PRODUCTS VIETNAM CO. LTD

  • Education

    • Ho chi minh city university of technical education

      2003 - 2008
      Bachelor's degree mechatronics, robotics, and automation engineering a
  • Experience

    • Intel technology malaysia

      Oct 2008 - Nov 2009
      Process engineer - eit at intel technology malaysia

      Design and run DOE (design of experiment) to define process parameters. Develop and qualify for new equipment for new process. Learn, apply statistical knowledge to qualify, stabilize new process (Cpk, control chart, monitor set...) Learn, apply development methodology, terminology to transfer new process to HVM (high volume manufacturing) be ready to start up Intel Products Vietnam

    • Intel products vietnam co. ltd

      Nov 2009 - now
      Process & equipment engineer - assembly new product integrator

      Process and equipment Engineer – ASM ball placement machine expert, SOC BA EIT leader be accountable for SOC and product transfer, responsible for tool upgrade and install qualification, the process/equipment to improving and maintaining the overall performance in term of safety, yield, quality and equipment performance to ensure the product reliability & productivity to meet the business goal. Continuous improve process and machine performance to increase run rate and eliminate waste in process. Currently working as Assembly New Product Integrator (NPI) be accountable for coordinate and planning new SOC product transfer to Intel VietnamTool install and qualification leader:July 2013 to Dec 2013: EIT 6 months in Intel Malaysia to learn to transfer SOC product to Intel Malaysia which totally new to current process. This product applied new pick and solder ball technique where require more accuracy due to small form factor. After 6 months on job training, new product and new process transfer flawlessly to production. Oct 2012 to Jan 2013: EIT 3 months in Intel Chengdu to catch up and transfer new Flux printing technology which apply for new chipset platform which deploy to product in Vietnam. Dec 2010 - Jan 2011: module team leader transfer new chipset product from Intel ChengDu China to Intel Viet Nam, new link install and product qual successfully deliver best production line to manufacturing 2 week ahead schedule. Show less

  • Licenses & Certifications