Tomasz Ninierza

Experience

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  LG Electronics

  Oct 2008 - Oct 2016

  Working as a junior manager / part leader in LCD/OLED TV R&D circuit department» Coordinating the work of three groups of engineering H/W, S/W, SMT (7 persons)» Approving engineering changes in products , substantive and qualitative grade of engineering reports.» Determination of new product introduction , setup projects grades.» Monthly department status reporting on front of LG Electronics Top Management: new models implementation status & present current product problems - QCD point of view.» Daily risk management of Main Factory KPI during production meetings.» Problem solving with the use of statistic tools.From 2008 Project Leader directly responsible for introduced new model on EU Market» Plan, Delegate, Monitor & Control all steps/tasks in project to expand effective cooperation between related departments: Quality, Material, Corporate Planning, Production, Purchasing.» Project Management with using BPM/DVPMS,DQMS systems.» Report of project status in to company Top Management during mile stone stages - PP/PV/MP.» Technical consultant of Chief Engineer Project Manager, develop procedures from electronics site. » Recurrence Prevention Head: gathering, analyzing all defect which occurred on: IQA/OQA/LQC/Field/Vendor area and execute permanent solution from all related departments. Show less UUnder 6 years of working in Europe LCD/OLED TV R&D circuit I crossed throughall engineering position (junior to senior engineer). Below I present my main duties:» BOM (Bill of Material) ~ 1000/year and ECO/ECR management.» S/W test & implementation (SMT vendor ↔ Factory → Customer).» Preparing S/W test cases & development existed based on a problem which occurred.» Management of Internal Programming Area through designing S/W download devices, preparing work instructions, employees training, calculation of capability according to Production Plan & Shipment Plan.» Solving technical problems & support following areas: LQC (Line Quality Control) MPCB vendor (SMT, DFT) OQA (Outgoing Quality Area) FFR (Field Failure Return)» Analysis & defining MPCB (Main Printed Circuit Board) defects.» Increase production capability and work facilitating by preparing production line for new models. Applied new devices necessary for mass production based on product requirements, optimize ST, T/T, line balance based on basis Lean Manufacturing tools.» EMC (Electromagnetic Compatibility) Long- term Cooperation with Institute of Innovative Technologies EMAG Katowice. EMC problem solving in 30MHz - 6 GHz band. Show less

  • Junior Manager / Part Leader at Europe LCD/OLED TV R&D circuit

    Mar 2015 - Oct 2016

  • Senior Engineer at Europe LCD TV R&D circuit

    Oct 2008 - Feb 2015
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  Lincoln Electric

  Oct 2016 - now

  After 2 years working as a PM I was promoted to a Mechanical Design Team Leader.Main responsibilities:» Work management of an international team responsible for products design & construction,» Project management - design & development of welding equipment which based on the best practice from Prince 2, Agile & PMP (Idea ↔ Execution ↔ Market Launch) » Controlling the project budget, time, quality, risks, resources balance, new suppliers development, project documentation, monthly reporting to main stakeholders. Show less

  • Product Engineering Manager, Equipment Industrialization

    Dec 2023 - now

  • Senior Project Manager & Mechanical Design Team Leader

    May 2018 - Dec 2024

  • Project Manager

    Oct 2016 - May 2018