Soon Lee Tan

Experience

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  Denselight Semiconductors Pte Ltd, Singapore

  Feb 2002 - Mar 2007

  Senior Process Engineer

  o Joined DenseLight upon graduation as pioneer team of engineers for the technology start-up from NTU. Developed and maintained Physical Vapor Deposition and Plasma Enhanced Chemical Vapor Deposition processes for Laser diode and photonic integrated circuits fabrication.o Developed and maintain processes for InP (1200 – 1700nm) Fabry-Perot Laser and DFB Laser wafer fabrication for Datacom, Telecom, and Sensing applications.o Developed and maintain processes for GaAs (808nm) Superluminesence LED wafer fabrication for Sensing applications. Show less

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  Philips Lumileds

  Mar 2007 - Sept 2011

  Manager

  o In 2007, joined Lumileds as pioneer team of engineers for the start-up of the Singapore plant. Stationed for 2 months in Lumileds San Jose, California for the technology transfer.o From Mar 2007 to Dec 2009, was the Senior Engineer in charge of starting up the etch equipment and process engineering module. Successfully start up and qualified a total of 12 ICP etchers in 2 years to enable Lumileds to meet all production ramp plans. Successfully evaluated, developed, and qualified the next generation of ICP etcher for the company. New etcher platform proved superior in terms of process capability and OEE in high volume manufacturing.o From Jan 2010 to Dec 2010, was the Chief Engineer for a project team to develop state of the art wafer processes for 6 inch GaN on Sapphire LED fabrication. Within one year in Dec 2010, the team achieved all targets, enabling Lumileds to become the first LED Company in the world to mass produce LED on 6 inch wafer.o Promoted to Etch Module Manager in April 2011. Lead a team of 4 Process Engineers, 3 Equipment Engineers and 7 Associate Engineers to meet operation targets.o Six Sigma Black Belt Project #1: ICP Etcher Overall Equipment Efficiency improvement (OEE). OEE improvement from 50% to 80% achieved in 6 months in 2010 through LEAN principles. Improvement translated to a CAPEX cost avoidance of USD 3.7 million. o Six Sigma Black Belt Project #2: Electrical Leakage Yield Loss Reduction. Yield loss reduction from 3% to 1% achieved in 6 months in 2011 through root cause analysis and DOE. Reduction resulted in hard savings of USD1.87 million. Show less

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  Elec-Tech International Co., Ltd.

  Sept 2011 - now

  R&D Director

  o In September 2011, joined a team of LED professionals to pioneer the start-up of a Flip Chip LED business unit in Dalian, China. Recruited and developed key local talents for its Manufacturing, Engineering and R&D functions. Currently lead a R&D department of more than 40 engineers responsible for LED chip research and development.o Define New Technology Roadmap to ensure product stay ahead of competition and initiate development projects to achieve roadmap.o Responsible for all aspects of R&D Project management: Scope, Time, Cost, Quality, Human Resource, Risk, Procurement, and Stakeholder.o Responsible for Product Life Cycle management from conceive to end of life.o To date developed and commercialized a total of 5 generations of world class GaN Flip Chip LEDs meeting the needs of various types of advanced white LED packages.o Presently leading a new research team to develop the next generation of self-emissive display technology known as Mini and Micro LED Display using inorganic LED. Show less