Howard Hsu, PhD

Experience

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  Saitama University (埼玉大学)

  Jul 2016 - Jul 2016

  Visiting Student

  Sakura Science Exchange Program (Sponsored by Japan Science and Technology Agency)

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  UC San Diego

  Jun 2017 - Aug 2017

  Research Intern

  Department of Electrical and Computer EngineeringAdvisor: Prof. Tse Ng (Tina) Ng

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  Nanjing University

  Mar 2018 - Jul 2018

  Visiting Student

  School of Chemistry and Chemical EngineeringAdvisor: Prof. Jin ZhongChemical exfoliation of 2D gray arsenene

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  National Yang Ming Chiao Tung University

  Jul 2018 - Jan 2024

  Ph.D. Candidate

  • Published 15 articles in peer-reviewed journals, secured 1 granted patent with 2 additional patents under review.• Innovated healable fabrics and smart clothing, receiving national media coverage and gaining interest from Taiwan’s textile industry. Supported by the Ministry of Economic Affairs with a US$100,000 commercialization fund.• Honor: National Innovation Award (2021), and NTSC Future Tech Award (2021).• Invited exhibitions: Taiwan Healthcare Expo (2021), Future Tech Exhibition (2021), and NYCU Outstanding Tech Expo (2022) Show less

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  Entegris

  Jul 2019 - Dec 2019

  Wet-Etch and Clean Application

  • Developed an advanced particle mobility analyzer for sub-10 nm particles, contributing to ultra-fine filter design at TSMC.• Applied machine-learning algorithms to streamline nanoparticle size analysis, enhancing report accuracy for customers.• Established surface charge analysis methodologies for SiN wafer surface characterization.

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  TSMC

  Sept 2020 - Mar 2022

  TSMC Joint Development Program

  • Collaboration with TSMC Pathfinding Department titled “Spin-On New Materials Development”• Developed a novel sol-gel technique to enable high-performance and low-cost gap-filling for the A10 node requirements

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  UC San Diego

  May 2022 - Jan 2024

  Visiting Graduate

  Department of Electrical and Computer EngineeringConcentrations: Polarized light photodetector enhanced by near-field electrospinning

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  TSMC

  Oct 2023 - now

  Principal R&D Engineer, CMP

  • Spearheaded development of TSMC’s N2, A16, and A14 nodes, focusing on MEOL and BEOL layers for backside power delivery; contributing to stable inline process control, and ensuring efficient HVM transfer.• Led the introduction and qualification of new CMP tools from Applied Materials into production, increasing throughput by 50% and ensuring alignment with fab production capabilities.• Collaborated with key vendors, driving over 10 CIPs including a new slurry formulation (reduce W over-polishing by 90%), real-time process control sensor upgrades (50% edge resolution increase), and new buffing chemical (80% cost reduction). • Built strong cross-functional partnerships with design, production, and vendor teams to manage design rule development and implement process improvements.• Invented and filed 5 patents, including 3 as sole inventor, focusing on innovative CMP tool and consumable innovations. Show less