JOONMO YOO

Experience

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  GCT Semiconductor

  Mar 2004 - Jun 2014

   Multi-mode multi-band MMMB system RF HW evaluation. Common jobs over all multi-mode RFIC engineering:  Build the evaluation board each (hardware) Schematic/Layout review & modification GSM RFIC (w/ Analog BB) verification/design-feedback CDMA RFIC (w/ Analog BB) verification/design-feedback FDD LTE RFIC verification/design-feedback Experience CMOS 0.11um technology Evaluated/Debugged RFIC w/ CMOS 0.13um from 0.25um Verified LNA integration & RxSAW-less Evaluated SHDR (Simultaneous hybrid dual receiver)  Debugged the new feature and well-shared the design feedback for further revision Single-chip multi-mode multiband RFIC  GSM Quad & WCDMA Quad & LTE B13/B4/B7 Evaluate and Setup the full system of measurement Understand/Study 3GPP specification for LTE additionally Made RF link budget for RF basic system requirement LTE specification based on 3GPP Rel 8 Prepare the domestic exhibition and show the full demo to the government and participated persons in exhibition 3GPP/3GPP2 specification knowledge accordingly Firmware development for each RF verification New engineering challenging:  Extend to work for Beidou (China Satellite) RF part with debugging/evaluating GPS/Beidou RF both. Evaluated for GSM/CDMA&EVDO digital interface verification/debugging for design feedback including System PLL/ADC & DAC and ABB part) Show less  Various CDMA products evaluation & design-feedback Multi-band Cellular/PCS/AWS HW tuning/evaluation GPS evaluation/optimization Multi-band + GPS system configuration  Rx diversity system evaluation Digital-controlled oscillator (DCXO) scheme adjustment Work with several vendors to customize Crystal’s spec. Develop and Evaluate GSM+WCDMA RFIC w/ Analog BB based on 3GPP Interface with Fujitsu BB Band configuration GSM GSM850/EGSM/DCS1800/PCS1900 (Quad) WCDMA 800M/1.8G/2.1G/1.5G (Quad) Evaluation Schematic/Layout Board build & HW tuning Implement GUI (based on MFC) to load SPI parameter Understand/Study 3GPP specification for GSM/WCDMA Made RF link budget for RF basic system requirement on GSM/WCDMA each Write Design verification plan & report (DVPR) Implement VEE auto-measurement program based on DVPR Many customers-supporting over various kinds of platform/transceivers China Telecom targeted China/Taiwan customers US Verizon/Sprint targeted China customers Samsung TN at Korea and Samsung Guangzhou Show less  PHS RFIC verification/design feedback for revision of RFIC.  RFIC evaluation board/reference HW build Schematic/Layout work HW matching & SW optimization Developed RF verification software with MFC interface Developed GUI for SPI Loading CDMA RFIC verification/debugging/design-feedback for RFIC revision Schematic/layout work for evaluation board build HW matching to improve RF performance Developed GUI for SPI loading (New) Implemented RF measurement tool by using Agilent VEE tool  CDMA RFIC system development Interface with CDMA BB from VIA Telecom, inc Firmware release and HW debugging  For Cellular BC0/BC10 and BC5 450MHz Technical support to VIA Telecom and many ODM companies On-site support and Problem/Solving for many HW and RFIC issues Widen the knowledge of 3GPP2 specification for CDMA2000 Made RF link budget for RF basic system requirement Give the technical training to the internal engineers and the  Implemented RF measurement tool by using Visual Basic Technical support to UT-Starcom Problem & Solving HW and firmware debugging on the phone-form factor RF Driver implementation for BB-RF interface and RFIC operation Show less

  • R&D manager in Mobile Platform division

    May 2010 - Jun 2014

  • R&D Manager in Principal engineering group

    Jul 2007 - Apr 2010

  • Staff Engineer in Principal engineering group

    Mar 2004 - Jun 2007
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  Melfas

  Jul 2014 - Nov 2016

  Group Leader (Su-seok) in Chip Development Group

  Chip development Group Leader and R&D Program manager Evaluate Touch controller IC and TDDI and Design feedback to the analog/digital designersFamiliar with the embedded solution based on ARMTechnical support to the customers and internal F/W and S/W engineersManage Final Test yield and realiability of ICExperience CMOS 0.11um/0.162um/0.18um for touch solutions and 90nm for TDDIUnderstand F/W algorithm and design approach to overcome the various technical barrierFamiliar with various Foundry site and Package house and organize/arrange the required thingsProvide China-oriented solution and interest to the local customerReponsible for the overall schedule of R&D in MELFAS and technical share with Melfas's internal Sales/FAE/Marketing/QA/Manufacturing division in order to make the same road.Simulate the original cost of the specific design and Suggest the cost-effective solution to R&D Show less

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  Celfras

  Nov 2016 - Mar 2021

  技术开发总监 （총감）
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  SKAIChips

  Mar 2021 - now

  Chief Operating Officer / Vice President