Farhan Hakimi

Experience

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  Universiti Sains Malaysia

  Oct 2017 - Jun 2019

  Simulate the best training for students in preparation for the future leadership of the State. The experience gained at the Dewan Perundingan Pelajar (DPP) Meeting cannot be obtained elsewhere. In fact, this opportunity is limited to student leaders who are elected through the Elections at each Institute of Higher Education. -The lineup of the 2017/2018 USM Student Representative Council (SRC).-Chairman of Secretariat of Multimedia and Public Relation. Simulate the best training for students in preparation for the future leadership of the State. The experience gained at the Dewan Perundingan Pelajar (DPP) Meeting cannot be obtained elsewhere. In fact, this opportunity is limited to student leaders who are elected through the Elections at each Institute of Higher Education.

  • Observer of Dewan Perundingan Pelajar (Student Parliament)

    Oct 2018 - Jun 2019

  • Vice Chairman of Student Representative Council

    Oct 2017 - Nov 2018

  • Members of Dewan Perundingan Pelajar (Student Parliament)

    Oct 2017 - Nov 2018
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  Western Digital

  Jun 2018 - Aug 2018

  Test Engineer (Pre-Intern)

  10 Weeks ISEP Program (Pre-Internship) in SSD Test Engineer Department (FA). The project assigned during the internship period was “Deep Dive in 1 Error Codes, prepare documentation on Cook Book and basic failure analysis guide”.The objectives of this project are:1. Exposure to the working environment and overall understanding of the organization function.2. Exposure to test equipment, process and data analytics and their impact on engineering processes.3. Learn Communication Skills and Time Management. Show less

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  Western Digital

  Jul 2019 - Sept 2019

  Test Engineer (Intern)

  10 Weeks RAMP Program (Internship) in SSD Test Engineer Department (FA). The project assigned during the internship period was “Yield Report & Failure Analysis on Power On & Host IO CSS product”.The objectives of this project are:1. Exposure to working environment and overall understand to the work as Test Engineer in Failure Analysis Lab.2. To learn troubleshooting and Failure Analysis Methods.3. To learn and understand various equipment such as Advantest MPT3K, Thermal Imager, and X-Ray.4. To find out Root Cause of Power On and Host IO failure on CSS product. Show less

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  Malaysia Youth Empowering Summit 2019

  Oct 2019 - Oct 2019

  Official Photographer

  Cover personal sessions with VIP/VVIP at VIP Room & Photobooth for most of the time. More of like a personal photographer.

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  Micron Technology

  Sept 2020 - Mar 2021

  Test Engineer

  New College Graduate (NCG) Program● Managed the installation, modification, upgrade, and maintenance of manufacturing equipment, ensuring seamless integration and minimal downtime.● Analyzed equipment performance and reliability, implementing proactive measures to maintain control over production processes and meet product quality standards.● Sustaining and improving key performance indices of the equipment through continuous improvement activities.● Monitored yield performance for high-volume manufacturing (HVM) products, identifying trends and addressing issues to maintain consistent output quality.● Facilitated Change Control Board (CCB) meetings to review data qualifications and oversee the smooth release of tester into production.Achievement:● Planned & successfully accomplish tester transfer & setup (FOAK & SOAK) in new site to support DDR3 & DDR4 RAM for Client & Server motherboard by complying Quality, Electrical & Test requirement.● Participated in RAM Cooling Fan DOE to improve temperature & yield performance. Show less

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  Ikramatic Systems

  Jun 2021 - Jan 2022

  Electronic Engineer

  ● Professional Training and Education for Growing Entrepreneurs (PROTÉGÉ) ProgramDesigned and developed schematics and PCB layouts for home automation systems using KiCad software.● Performed functionality tests on hardware using Arduino software, identifying and resolving issues to ensure products met performance and quality standards.● Analyzed and resolved design-related issues promptly, improving overall efficiency and reducing development time.● Collaborated closely with software and project teams to understand and implement customer requirements, ensuring alignment and successful project outcomes.● Placed and installed THT/SMD components on PCBs using reflow ovens and soldering stations, ensuring high-quality and reliable hardware assemblies.Achievement:● Reduced overall PCB dimensions and component arrangement complexity by 10%, resulting in more efficient use of space and materials.● Improved thermal dissipation on step-down bulk regulators (5V and 3.3V) by 20% through the implementation of a ground plane heat sink & VIA, enhancing system reliability.● Designed & produced Jig & CP2104 Module PCB as a programmer / output monitoring on ESP-32 microcontroller.● Created/customised electronic footprint, 3D STEP CAD files to provide a comprehensive 3D visual of the entire system, improving assembly accuracy and reducing errors.● Worked closely with the mechanical team to integrate the rechargeable module and main PCB into a single package, enhancing product compactness and functionality. Show less

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  Intel Corporation

  Feb 2022 - now

  Product Development Engineer

  MPE HVE Product Development Engineer• Collaborated with global cross-functional teams to deliver Intel’s product roadmap by ensuring the readiness, robustness, and scalability of manufacturing test infrastructure throughout the product qualification process.• Performed evaluation and debug of new test programs, resolving manufacturability issues related to product testing hardware and software during NPI until HVM product milestone.• Conducted comprehensive data analysis, provide recommendation to improve test coverage yield, hardware capacity, and other product health indicators.• Enabled & optimized Product Quality Monitoring Screen (Statistical Bin Limit) including Risk Assessment, Data Analysis, Lot Disposition, Rework Flow Checklist, & Root Cause Analysis. • SBL Representative for Intel Kulim site – leading quality monitoring updates and facilitating knowledge and capability sharing across teams.Achievement:• Successfully deploy Product Quality Monitoring Screen for multiple DCAI products during NPI stage ensures that products meet predefined quality criteria consistently, reducing variations that could lead to defective units. • Validated and deployed test plans with a single BOM merge to ATM for DCAI CPU, resulting in a positive revenue impact of $40-60 million.• Achieved multiple test socket/condition elimination through DOE/data collection & debug for DCAI product family ahead commits approximately 2 months pull in ahead schedule.• Documented & guide team on Product Quality monitoring capability by emphasizing POR/BKM to make sure team copy exactly (CE) to avoid unexpected risk to internal/external customer.• Successfully identify root cause impacting DCAI CPU products with yield fallout ranging from 0.3-3.3% involving multiple DOEs & RV under different test conditions.• Managed and performed reject reclaims DCAI CPU units across multiple test socketing/condition areas, preventing unnecessary losses and reducing fallout by 25%. Show less