Holm Geisler

Experience

• 

  Aarhus University

  Oct 1996 - Mar 1997

  Research Assistant

  Postdoc working in the field of metastable phase formation in metallic multilayer thin films. Thin film deposition by PVD, Nanoindentation, film stress characterization, XRD (also at Synchrotron in Hamburg).

• 

  Technische Universität Dresden

  Apr 1997 - Mar 1999

  Forscher (Postdoktorand)

  Arbeit im Sonderforschungsbereich "Struktur- und Phasenbildung in Grenzschichten" im Bereich Werkstoffwissenschaften. Analytische TEM Untersuchungen (EFTEM, EELS) an Fe/Al Vielfachschichten.

• 

  AMD

  Apr 1999 - May 2009

  Team Lead Microstructure Characterization.Nanoindentation, X-ray Diffraction, Scanning Probe Microscopy. Industrial Liaison in SRC project with Stanford University. Specialist for microstructure characterization and surface analysis in the Materials Analysis Laboratory. Microstructure characterization of copper interconnect structures. X-ray diffraction (stress, strain, texture), nanoindentation, mechanical properties of low-k and ULK thin films, nano-scratch tests, AFM, UFM (Ultrasonic Force Microscopy), SCM, SSRM, SIMS, TOF-SIMS, four-point-bend adhesion tests.

  • MTS

    Apr 2002 - May 2009

  • Materials Analyst, Senior Materials Analyst

    Apr 1999 - Mar 2002
• 

  GLOBALFOUNDRIES

  Jun 2009 - now

  Team Lead in the Microstructure Characterization Group of the Center for Complex Analysis. Responsibility for Nanoindentation techniques and X-ray Diffraction analysis. Supervisor of many students (Master and Diploma thesis) and internships. High level analytical support for microchip fabrication and development, especially in the field of CPI, BEoL and FEoL. Stress/strain analysis using High-Resolution X-ray Diffraction. Mechanical stability analyses. Team Lead in Microstructure Analysis group of the Center for Complex Analysis. Responsibility for nanomechanical analysis (nanoindentation techniques) and X-ray diffraction. Advisor of Diploma and Master Students as well as internships in the field of Materials Science. High level analytical support for semiconductor chip fabrication. Expert for strain analysis using TEM Nanobeam Diffraction.

  • Senior MTS Lab Services

    Jan 2019 - now

  • Senior MTS Complex Analysis

    Apr 2013 - now

  • MTS Complex Analysis

    Jun 2009 - Mar 2013