Anwar Mohammed, PhD

Experience

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  National Semiconductors

  Jan 1993 - Jan 1996

  Manufacturing and Engineering Manager

  •Successfully managed all aspects of MCM/Thick Films for National Semiconductors, including materials and process research, high volume manufacturing, technology transfers and the management of all national and international manufacturing.•Revamped the Document Control, and Mask Fabrication Departments to cut costs and slash lead times significantly. •Capably led the activities for the development and manufacture of SLIM Telecom modules in challenging conditions. Received National's prestigious "Corporate Mission Award".•Designed, developed and manufactured millions of high precision hybrid multichip modules in USA and Asia. Show less

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  Micro Module Systems

  Jan 1996 - Jan 1998

  Senior Manager for Package Development

  •Actively lead the process development, prototyping and high volume manufacturing for all multi-chip modules.•Spearheaded the selection, auditing and management of all global supplier/partners.•Skillfully interfaced with customers including Intel and Sun Microsystems to determine product requirements and to resolve technical and manufacturing issues.•Successfully designed with Intel a state of the art multi-chip module with fine pitch Au wirebonding (1200 bonds at 30 microns pitch) and thermally efficient packaging.•Capably managed all prototyping and high volume manufacturing activities for the company while meeting stringent cost and quality metrics. Show less

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  Cree Microwave

  Jan 1998 - Jan 2005

  Director of Packaging/Subcon Mgt.

  •Proficiently managed the high volume manufacturing (HVM) of Cree RF power amplifier and LED modules. •Successfully accomplished the selection, qualification and management of international vendors for LED and RF power amplifier products.•Effectively guided the selection and development of materials, packages, processes and reliability plans for RF power amplifier modules.•Successfully set up and managed a new facility; manufacture small volumes (<200 units) for prototyping and process development. Developed novel manufacturing approaches, including flip chip bonding for LED devices and deploying high thermal conductivity (>50W/mk) epoxies for power packages.•Successfully spearheaded the activities for developing a state of the art, low-cost ceramic power amplifier module which reduced the cost significantly while enhancing the thermal performance by 30%.•Capably led the technical projects for the development, qualification, prototyping and manufacturing of key LED technologies. Show less

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  Eoplex Technologies

  Jan 2005 - Jan 2007

  VP of Technology & Operations

  •Capably managed the technology, manufacturing and operations of this dynamic company that created award-winning disruptive technologies for 3D ceramic and metal products. •Guided the operations of a dynamic start-up company with a very exciting technology dealing with power products.•Successfully managed the IP portfolio of this techno-centric company. •Skillfully guided the growth of a start-up company with a powerful technology platform, while developing new customers and products for emerging markets like energy harvesting and micro batteries. Show less

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  Infineon Technologies

  Jan 2007 - Jan 2010

  Senior Staff Scientist

  •Successfully managed the package development, manufacturing and qualification of all RFIC products for the company. Led a strong, multinational, technical team with the challenging mandate of qualifying the company’s first set of RFIC high power products with new cost-effective packages. •Developed novel processes, design and materials for new high power packages and reduced the manufacturing cost by over 50%. Successfully transferred products from early prototype phase to high volume manufacturing (HVM). Led the selection and management of international vendors and assembly sites.•Spearheaded the proper selection of materials, design, assembly processes and packages to pass stringent qualification and reliability requirements. Effectively led the development of some leading edge, world-class processes, especially for die attach, wire bonding, encapsulation and power management. Show less

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  Huawei

  Mar 2010 - May 2013

  Senior Staff Scientist, Advanced Interconnect & Packaging

  •Developed and implemented Advanced Packaging & Interconnect Technology Roadmap for Huawei •Spearheaded the project for 2.5 D and 3 D packaging technology. •Led the development for miniaturization and thermal management at the chip, package and board leve•Global Technology Owner(GTO) for mission critical Packaging technologies for Huawei

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  Flex

  Jan 2013 - Jan 2018

  Senior Director, Global Engineering and Manufacturing

  • Led Advanced Engineering Group (AEG). Spearheaded all support activities for global sites. Developed and deployed key manufacturing technologies, curated, and shared manufacturing best practices, offered DFX services to site and customers, conducted site technology qualifications and certifications, managed site technology capability trackers, and supervised all manufacturing escalations for 100-plus manufacturing sites in 30 countries. • Spearheaded technology development while mitigating manufacturing challenges for all company products, including products in defense, aerospace, medical, automotive, and RF space.• Developed world-class innovation labs to engender rapid disruption (including advanced assembly, microelectronics packing, 3D printing, augmented / virtual reality, and reliability / failure analysis for process characterization).• Designed and developed state-of-the-art manufacturing technology roadmaps and deployment packages while globally curating and sharing best practices.• Led and managed one of the finest technology labs in Silicon Valley where we defined, developed and deployed leading-edge technologies for more than 100 Flextronics sites in over 30 countries.• Pioneered global manufacturing and development of Flexible and Stretchable products, encompassing wearable technologies, with primary authorship on numerous patents. Show less

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  Jabil

  Jan 2018 - Jan 2024

  Senior Director, Global Engineering & Manufacturing

  • Led and inspired global, multicultural team with annual revenue of over $35B. • Conceptualized, created and deployed leading-edge technologies at 'Factory of the Future' sites leveraging AI, Machine Vision, M2M communications and Predictive Data Analytics• Led Advanced Manufacturing Technology (AMT) group. Developed and deployed best-in-class manufacturing technologies and operational procedures for all global sites for manufacturing across automotive, medical, defense, energy, infrastructure, photonics, and other dynamics markets.• Spearheaded and facilitated the development of Jabil Manufacturing Technology Roadmap recognized. • Steered AI / ML initiative for Jabil Engineering, resulting in groundbreaking success and opportunities. • Championed efforts to continuously improve reliability, quality, FPY, efficiency (OEE and OLE), OTD, safety, scrap, and transformation cost.• Anticipated, prevented, and managed all manufacturing escalations globally. Advocate for Global continuous process improvement (CPI), Lean Sigma, and DFM/X Improvements.• Managed regular meetings with leadership, business unit directors, and Quality and IT team to meet sales, quality, and technology goals. Interacted with customers and CEOs of key suppliers as needed. • Developed strong partnerships with material and equipment supplier partners to facilitate “privileged relationship” status and exclusivity agreements. Collaborated with academia and consortia to accelerate technology growth.• Mentored, trained, and certified a team of 5,000-plus world-class SMEs annually to engender significant competitive advantage for company. Proficient in employee recruitment, motivation, and retention. • Responsible for P&L management and IP development for global AMT team.• Served as a member of Jabil’s Technology Strategy Advisory Committee (2018-2024). Show less