Harish MV

Experience

• 

  Bharat Electronics Limited

  Jun 2015 - now

  1. Led new product development and product architecture for electro-mechanical andmechanical components tailored for aerospace and defense applications.2. Expert in electronic hardware packaging and 3D CAD modeling, delivering optimized, reliable,and compliant designs that meet stringent aerospace and defense standards.3. Skilled in value engineering, focusing on cost reduction while enhancing performance throughdetailed evaluations.4. Spearheaded the development of thermal solutions and simulations for electronic systemsand subsystems, ensuring optimal performance in challenging environmental conditions.5. Proficient in structural analysis, performing dynamic load simulations, vibration, shockanalysis, and isolator selection to ensure mechanical components endure harsh environmentalconditions.6. In-depth knowledge of materials, manufacturing methods, and design principles for DFM andDFA, with expertise in hydraulic actuators and mechanical truss members design.7. Contributed to RFP, pre-bid, and proposal processes for new product development, supportingbenchmarking, CDR, PDR, and CrDR reviews.8. Demonstrated leadership and mentorship by guiding design team, collaboration with crossfunctional teams, system group, DRDO labs and design agency for the successful executionof projects and devolvement of technology.9. Conducted failure analyses and implemented product design improvements, significantlyenhancing product performance and reliability.10. Proficient in design verification using FEA tools, conducting lab and field trials, and validatingnew products to ensure full compliance with MIL-STD, DO-160, and EMI/EMC standards.11. Strong Communication and report writing Skills, data acquisition and data visualization.KEY SKILLS1.3D modeling/CAD2.Thermal Management3.Structural Analysis4.CFD Simulation5.Documentation, GD&T6.Statistical Analysis/Minitab7.SOLID WORKS/CREO8.ANSYS ICEPACK9.ANSYS WB10.SAP11.ANSYS Fluent12.SQL13.PYTHON Show less 1. Engineered thermal management solution for single-board computer, designing a conduction plate using advanced materials to optimize heat flow and enhance performance and reliability through efficient heat dissipation.2. Design & development of Main Processing unit for aerospace & naval application, system level architecture design of ATR system compliance with VITA46. 3. Designed optimized thermal wedge lock for conduction-cooled systems, enhancing heat dissipation for GPUs and single-board computers (SBCs).4. Performed 1D hand calculations to optimize airflow capacity, thermal resistance, and pressure drop in forced cooling chassis for improved performance. 5. Designed and developed GNSS GPS receiver unit for submarine platform, implementing conduction cooling for effective thermal management and enhanced performance.6. Designed and developed a touch screen display module, including thermal management through innovative heat tower design to ensure optimal performance and reliability in various operating conditions. Show less 1. Designed and developed the product for a bulk data encryption card cage unit, focusing on robust data security, efficiency, and reliable performance.2. Designed PCB layout and pluggable card placement, optimizing temperature distribution to improve system performance and reliability.3. Designed heat sink for BGA component on encryption card, incorporating optimized air baffle design and thermal simulation for enhanced forced airflow and cooling efficiency.4. Managed thermal performance of network rack and static server room, including fan selection and mass flow rate calculations based on heat load, optimizing airflow and temperature distribution for efficient cooling.5. Conducted detailed vibration analysis of sheet metal encryption chassis, ensuring structural integrity and performance under various operational conditions. Show less Projects: GPS receiver for Submarine, Main Processing unit for Naval & aerospace Indigenous Design & development of GPS receiver unit for submarine. 1. Design of Development of VITA: 46 modules – VPX based sub module for navel/airworthy ATR system. Pioneered in the design and development of a modular and upgraded-able single board computer (SBC).Hand calculation and FEA analysis for the shock mount selection for main processing unit for naval platform to meet 280g shock dynamic. 2. Chip-level thermal management for VPX modules (SBC, GPU and Power modules). 3. Guided team of design engineering team for the revamp of Tracked Vehicle Electronic Integration of C4I system Detailed design and development for the integration of C4I network and communication system for command post tank. 4. Precise weight budgeting, center of gravity calculation, system integration and amphibious study for the battle tank. 5. VPX back plan design, VPX pluggable module PCB design as per VITA STD6. Design and development of PCB testing jigs and fixtures.7. PCB layout design and placement of interfaces as per product application. Show less

  • Principal Mechanical Engineer

    Jan 2024 - now

  • Deputy Manager

    Sept 2018 - Jan 2024

  • Product Design Development Engineer

    Sept 2011 - Jun 2022

  • Senior Engineer

    Jun 2015 - Jun 2018