Mathias Inghelbrecht

Experience

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  EADS

  Feb 2008 - May 2008

  Bachelor Thesis

  Secundary radar antenna uplink measurement system- Converting the analog signals to digital signals by using an ADC.- Transmitting the digital signals to the graphical programming software HPVee by using the QuickUsb of the FPGA.- Visualization of the 3 receiving secundary radar pulses on a screen (i.e digital oscilloscope) by using the HPVee software.

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  Leibniz Universität Hannover, Germany

  Mar 2011 - Aug 2011

  Master Thesis

  Thesis: Investigation of radiation, reflection phenomena and transmission line effects for a bend in a wire- Investigation of the characteristic impedance of the copper wire at several heights above a ground plane & impedance conversion methods to maximize the power transfer (e.g. λ/4 transformer, π-network with L/C, stub by using smith diagram,…).- Investigation of several methods to calculate the radiated, transmitted and reflected power (processing the data by using Matlab).- Simulations (EMPro Software) and practical measurements (Vector Network Analyzer, Spectrum Analyzer) for investigating the parameters by using TDR, s-parameters, H-field measuring along the wire. Show less

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  Connectgroup

  Nov 2012 - Jun 2014

  - Searching, suggesting & evaluating the alternative electrical- /mechanical components (PCB layout, RoHS compliant, technical specifications, price, obsolete).- Creating & searching of component specifications into the ERP system (SAP). - Evaluating the offered supplier components.- Responding the technical questions of the buyers/ product engineers Czech Republic & Romania.- Coordination of the components in the production plants: Belgium, Czech Republic, Romania & Germany. Show less

  • Technical coordinator

    Feb 2013 - Jun 2014

  • Component Engineer

    Nov 2012 - Feb 2013
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  TP Vision

  Oct 2014 - Jun 2016

  EMC/RF Engineer

  - Final responsibility regarding to EMI for each Philips television set (8 different sets).- Analyzing and solving EMC problems in a FAR (Full Anechoic Chamber) & SAR (Semi Anechoic Chamber) and suggestions towards the relevant designers for future design & reporting to the appropriate managers. - Concept testing, pre – compliance & approbation (business trips to official approbation lab CSA Group Germany) according to the TV standards (ESD Standard EN61000-4-2, radiated/conducted emission Standard EN55013/32, Harmonic current emission Standard EN61000-3-2). - Solving the electrical/mechanical design, PCB/set design (e.g. cabling) and architecture (FMEA) in Ghent & Xiamen (China).- Keeping up to date by following events (e.g. Rohde & Schwarz, Blue Guide EMC lab, Würth elektronik, EMC Europe).- Reproducing & solving customers problems regarding to Philips TVs in a full anechoic chamber (e.g. investigation on radiated immunity disturbance on the TV tuner by using the operating modes: Analog + DVBC with different phase modulated in-band & out-band disturbance frequencies).- Notions of the immunity standard EN55020/24 (business trip CSA Group Germany), e.g. I3 Radiated radio frequency electromagnetic field, I5 Surge, S1 Immunity to antenna input connector, S2c Immunity to RF voltages at antenna terminals. Show less

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  ASML

  Nov 2016 - now

  EMC Engineer

  - Final responsibility regarding compliancy for the next platforms: Yieldstar (Oktober 2016 - February 2017), NXT/XT ( March 2017 - present), NXE (October 2017 - present).- Risk Assessment/Critical Design Review in early design stage for conformity to the directive 2014/30/EU regarding electrical layout/ mechanical/ PCB design (e.g. grounding, shielding, filtering on electronic cabinets/ racks/ modules/assemblies/cables and PCBAs).- Monitor and improve the ASML subcontracted designs of modules.- EMC lab manager (responsible for calibration on time of the EMC equipment by the external company DARE, contact person for borrowing equipment, registration of new equipment).- Provide expertise to external subcontractors/co-developers and assistance (trouble shooting) in problem solving for EMC issues.- Provide solutions for measuring and qualifying non-standard EM- phenomena. E.g. Conducted emission by using a Capacitive voltage probe.- Sub- system & system qualification for compliancy to the industrial standard (Immunity: IEC61000-6-2 & Emission: IEC61000-6-4) and FCC 47 part 15 (IT equipment)/part 18(ISM equipment) + Customer semiconductor requirements (SEMI E33 + SEMI E78 ) + HALT (Overstress Testing).- Participating in the NEC EMC Dutch Standardisation Committee TC77 as O-member (Observer).- Collaboration with Technical University Eindhoven : GTEM Cell.- Responsibility for buying new EMC equipment with a total budget of 320 000 euro. Show less