Albert Lai

Experience

• 

  Texas Instruments

  Jan 1998 - Jan 2000

  Application Engineer

  Major worko Din/Dwin collaboration o DSP demo kit and reference design development o Speaker of DSP seminar Related Achievementso DIN cases- First high power UPS controlled by TI’s DSP, Delta First electronic bike controlled by TI’s DSP, TELCOo DSP Lab established in Taiwano Design reference book in terms of DSP 24X, Motor control

• 

  CDS Enterprise Co., Ltd.

  Sept 2001 - Aug 2004

  Image Recognition Group R&D team Lead

  Major worko Product and Technique team leado Image recognition products designo Patents roll outRelated Achievementso Team managemento Biometric products roll out (Fingerprint, Face recognition)o 10+ patents issuedo Reduce design cycle time up to 50% in terms of DSP products

• 

  Microsoft

  Sept 2005 - Feb 2010

  Account Technology Manager

  Major worko Evangelize Windows Mobile product and customers management including Acer，Benq，Compal，Inventec，Quanta，Wistron… etc.o Work out new projects spec including s/w and h/w with customerso Make sure key projects landed on timeo Escalate and manage major products bugs and issues o IHV/ISV relationship build up Related Achievementso General Manager Award 2007, Microsoft o Going Beyond Award 2006, Microsofto Smart phone landed- Acer S200(Qualcomm 8K- 1GHz), E100(Cheapest Widows phone) Benq E21 (NFC application) Motorola A3100 Surf® (Compal Comm) ETEN Glofish® DX900(Dual SIM), DX650(Dual Display) O2 AL-G (Quanta)o Technical day for OEM customers (Acer, ASUS, Benq…) Show less

• 

  光寶科技

  Aug 2010 - Sept 2011

  Senior Manger - Product Marketing

  Major work o Conduct PM team o New products introduction o New Business/Market development o Partnership Established (Vendor, Customers)Related Achievements o SiP product introduction o WMT product introduction o 2 years product roadmap proposed o New Customers cooperation (Wistron, Benq, AUO, HTC) o Patent issued (LP2010-068-TW, 一種無限影音傳輸模組，可攜式無線影音傳輸裝置，影音產生裝置及影音撥放裝置)

• 

  致伸科技股份有限公司

  Nov 2011 - now

  TL Lead

  Camera Module/Product Design and Manufacturing-o Optic knowledge and camera product design capability as a camera product consultanto 10+ worldwide patents issuedo Essential components selection and refined in terms of CMOS image sensor, Optoca lens, Actuator (VCM, SMA), Substrates( Ceramic, Rigid-Flex, EOMIN)...etco Familiar with different structure of CCM on CoB, CSP, CoS, CoF and Flip-Chip...etc o RFQ and Design review with world class OEMs (Amazon, Moto, local China brand company Meizu…etc). o Technical leader conduct project team including ME, EE, SW and NPI to work out camera module o Partnership or suppliers collaboration with Lens (Largan, Genius…etc.), Sensors (Sony, Samsung, OVT… etc), Substrates (Kyocera, TAIYO YUDEN, Si-flex…etc) and Actuators (TDK, Mitsumi, Alps…etc) Show less