Lin Zhao

Lin Zhao

Engineering Internship

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  • Timeline

  • About me

    Senior Product Engineer at AMD

  • Education

    • National University of Singapore

      2012 - 2015
      Bachelor of Engineering (B.Eng.) Electrical and Electronics Engineering Graduate with Honours (Distinction)

      Activities and Societies: Marketing Executive, NUS Chinese Calligraphy Society

    • Nanyang Technological University

      2020 - 2024
      Doctor of Philosophy - PhD Computer Science and Engineering

      Research area: enabling advanced analytics in industrial applications

    • National University of Singapore

      2015 - 2017
      Master's degree Electrical and Electronics Engineering

      Master of Science in Electrical Engineering Course work highlight: Neural Network Optical Engineering, Optical Communications and Networks

  • Experience

    • Infineon Technologies

      May 2014 - Aug 2014
      Engineering Internship

      Intern1. Learned and applied JMP software to improve data analysis efficiency2. Worked on electrical contact improvement project. Analysed the electrical contact data to predictthe probability of the electrical contact failure. The socket lifetime extended by 2 to 4 hours onaverage3. Worked on production line Overall Equipment Effectiveness(OEE) enhancement project,collected and analysed machine index to investigate root cause of machine failure. Successfullyimprove OEE by 4%mprovement project Show less

    • GlobalFoundries

      May 2015 - Dec 2019
      Test and Diagnostic Engineer

      Test and Diagnostic Engineer in Technology Development Department1. Designed and developed a Multi-Layer Perceptron Neural Network to predict the possibility of successfully finding the defect location on failed chips. The system was trained by past successful cases to assess if the incoming brand-new chip’s defect can be observed in succeeding failure analysis (FA) process. The system not only helps automating the process of selecting good candidates for FA, but also identifying the chips which may be overlooked by conventional method, with an accuracy of 83%2. Cooperated with different functional teams to investigate the failure mechanism and localizedefect of the chip through testing data and Electrical Failure Analysis techniques. Havesuccessfully diagnosed for more than 40 products3. Liaised with customers from different countries such as Germany, China and America to developtest program in C, C++ and VBA as well as to hardware setup in Advantest 93K tester and Teradyne FLEX testers. Show less

    • AMD

      Dec 2019 - now
      Senior Product Engineer

      Design and develop analytical solutions and platforms for semiconductor manufacturing data

  • Licenses & Certifications