
Xinglu Wang
Research Scholar

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About me
Yield Development Engineer at Intel Corporation
Education

The University of Texas at Dallas
2018 - 2022Doctor of Philosophy - PhD Materials Science and EngineeringDissertation Title: Mechanism of Fermi Level Pinning for Metal Contacts on Transition Metal Dichalcogenides and Their Interface Thermal Stability

Hebei University of Technology
2011 - 2015Bachelor's degree Electronic Science and TechnologyGraduated with honor

Nankai University
2015 - 2018Master's degree Electronic Science and TechnologyThesis Title: Surface Morphology, Interfacial Chemistry and Thermal Stability Study of InAs and GaP/High-κ Dielectrics StacksGraduated with honor
Experience

SRC Research Scholars Program
Sept 2019 - Dec 2022Research ScholarSRC nCORE NEWLIMITS Research ID: 2819 — NEW materials for LogIc, Memory and InTerconnects;Dissertation: Mechanism of Fermi Level Pinning for Metal Contacts on Transition Metal Dichalcogenides and Their Interface Thermal Stability

Intel Corporation
Jan 2023 - nowYield Development Engineer
Nov 2023 - nowFailure Analysis R&D Engineer
Jan 2023 - Oct 2023
Licenses & Certifications
- View certificate

Peer Review Excellence Graduates
IOP PublishingDec 2022
Honors & Awards
- Awarded to Xinglu WangHonor Graduate Student Nankai University Jun 2018
- Awarded to Xinglu WangNational Graduate Fellowship Ministry of Education of the People's Republic of China Nov 2017
- Awarded to Xinglu WangHonor Undergraduate Student Hebei University of Technology Jun 2015
- Awarded to Xinglu WangRanking 2nd in China Undergraduate Mathematical Contest in Modeling Ministry of Education of the People's Republic of China Sep 2013
Languages
- 中文中文
- enEnglish
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