Daniel Kollmer

Experience

• 

  Endress+Hauser Gruppe

  Nov 2008 - Jul 2021

  Field of work:Leading the interdisciplinary Team "Workgroup Electronics"Digitalization: - Digital Twin: - "Why": - Working out and presenting the holistic "Big Picture", the struggles and why it´s worth doing it - Digital Twin is basically an old goal dressed in top of the notch technology - Digital Twins will sharpen or even shift our perception of "reality" - AI is needed to evolute Digital Twins - "How": - working out and presenting holistic approaches to create Digital Twins (parts, products, processes, companies) and the role of AI - Old but proven methodical competences need to do the transition from physical -> cybernetical -> virtual world - Digitalization is not solemly for the privileged ones: - How standard office tools can be used to bring the idea of high quality data near to employees and the worth of it - "Who": - The people, their skills and diversity needed - The organisational units - "What": - Sketch The manifold business cases that can be evoluted, e.g.: - Design Chain - Supply Chain - Quality chain - business intelligence - Risk Management - LEAN - Best in Class- Working out Concepts "Digitize Expertise"PCB/PCBA:- Inventing/defining/qualifying a new conformal coating material and concept for PCBA protection- Create a vision of electronics in the age of IIOT, Digital Twins and VUCA-World- Define technical audit checklist für PCBA Audits.- Supporting purchasing division: - Technical consultance during PCB / PCBA audits for external suppliers (China, Thailand, Sri Lanka, India, Switzerland) - Consulting on supplier education: quality improvement and cost reduction in one step. - Investigating and consulting on MLCC broker quality during allocation times. Supporting quality division:- Managing and investigating PCBA production-/field-failure analysis: - Electrical, mechanical, (electro-)chemical - Zero defect in electronic production Show less Field of work:PCB/PCBA:- Dive into these topics and defining delivery instructions for suppliers- Quality assurance throughout Design and fulfillment process (e.g. PPAP)- Packaging technologiesIndustrie 4.0: - Evolving concurrent engineering process within R&D concerning CAD / CAE interface:- Finding and evolving a new CAE data format for having comprehensive all-in-one data for the design&fulfillment process concering production-/programming-/testing of PCBAWorking in interdisciplinary teams:- Defining and analyzing new test concepts, e.g. requirement engineering for new inline AXI- Researching new production technologies/ materials, requirement engineering, e.g. revolutionary new Conformal Coating material- Looking for and working together with strategic partnersConsultance during design phase, concerning:- Design to cost e.g. for cusomized connectors- Packaging technologies- PCBA designs for max. automated production & testing- Design of PCBAs with respect to relevant standards, eg. Atex IEC 60079-xx (particular Ex d, Ex e, Ex i, Ex m), IEC 61010-1- PCBA design considerations for conformal coating- Environmental testing of PCB/PCBA eg. acc. to IEC 60068-xx Show less Being a member of the Proline 3 Flowmeter Platform Architecture Team:- Defining the modular based PCBA concept- Defining the power supply architecture- Defining the explosion proof architecture (e.g. ATEX IEC 60079-xx)- Defining functional safety concept- Defining the plattform interfaces, especially electrical connections, internal and user connections with respect to explosion proof, signal integrity, EMI and max. automated producability.- Defining microcontroller/microprocessor and memory concept- Evaluating best fit microcontrollers/microprocessors- Managing concurrent ECAD <-> MCAD Design- Proline 3 devices, EMI proofing: testing, debugging and solving prototype issues. PCBA designs for Proline 3 Platform:- Design and managing of several Proline 3 backplanes and terminalprints- PCBA design-in for our flying pobers to solve constraints at that time- Make our flying probers capable for inline uC-/uP programming- Defining and designing the platform HMI for Proline 3 + low power devices, featuring:- explosion proof, intrinsic safe- mechanical-/optical-keys- low power backlight- with/without Bluetooth - Remote installation up to 300m wiring Show less

  • Senior Expert Design Chain Electronic, R&D

    May 2019 - Jul 2021

  • Expert Design Chain Electronic, R&D

    Feb 2017 - Apr 2019

  • Hardware Design Engineer, R&D

    Nov 2008 - Jan 2017
• 

  Würth Elektronik Group

  Aug 2021 - now

  • Head of Division Engineering & Technical Project Management

    Jun 2022 - now

  • Team Leader, Competence Center Industrialization

    Aug 2021 - May 2022