Ong Yee Pin

Experience

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  AMD

  Jun 2013 - Aug 2013

  Internship
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  Universiti Sains Malaysia

  Sept 2013 - Mar 2017

  Master Student
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  Knowles Corporation

  Apr 2017 - Nov 2021

  • Perform failure analysis on units based on failure mode to determine the failure mechanism for risk assessment and process improvement. • Non-destructive analysis includes X-ray, optical inspection and unit testing. • Electrical testing and fault isolation by performing IV characteristics, charge pump voltage measurement and capacitance voltage measurement. Personal Particulars Working Experiences Personal Profile • Cross-section on units with conventional cross-section machine and leica trimming system. • Analyse surface morphology of particle and particle mapping with Scanning Electron Microscopy (SEM) and Energy Dispersive X-Ray Analysis (EDX). • Acoustical testing involving sensitivity, noise and total harmonic distortion ratio with audio analyser.• Train technicians on reporting and failure analysis methodology.• Manage and assign requests to technicians. • Dealing with vendors on equipment support and services. Show less

  • Reliability Engineer

    Sept 2020 - Nov 2021

  • Failure Analysis Engineer

    Apr 2017 - Nov 2021
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  Ams OSRAM

  Nov 2021 - Nov 2024

  Advanced Product Quality Senior Engineer

  • Govern and contribute to New Product Quality and Reliability processes: - Upstream activities including Technical Risk Assessment, Requirement profile, Reliability Test requirement generation, Design FMEA, Process FMEA, Material Robustness, Design Robustness, Process Robustness, Lifetime Prediction.• Responsible for New product Reliability Qualification, Evaluation, Robustness (including Material, Design, Process robustness and Integration study & datasheet update).• Pre-series activities including Safe Launch, Debugging and Steering Monitoring, Reliability monitoring plan setup.• Conduct internal line audit for the new process and assembly line setup, in assessing both technology and system readiness prior series production.• Review and govern quality detection control documentation readiness & changes for new products (Failure Catalog, Control Plan, OCAP, Work Instruction, Buildsheet). • Core team member contribute to solve product quality issue from safe launch, debugging run & mass production together with R&D and operation team. • Customer quality support activities including Customer Complaint, Internal 8D, RMA, PPCM, Risk assessment, Special Clearance, Shipment Halt and Release. Show less

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  ASE Electronics (M) Sdn Bhd

  Dec 2024 - now

  Failure Analysis Section Head