Kelly Smith

Experience

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  Compaq Computer Corporation

  Jan 1997 - Jan 1998

  Mechanical Design Engineer, Notebook PC Product Development

  Contributed to organizational goals by designing plastic and sheet metal components for notebook PC and accessories, received multiple patents, partnered with cross-functional teams, and managed relationships with Asian ODM design and manufacturing partners.

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  HP

  Jan 1999 - Aug 2012

  Senior Manager, Mechanical Product Development

  Led product development operations with a team of 21 Mechanical Engineer and Thermal Engineer direct reports in the US and Taiwan including design, testing, validation, and manufacturing of industry-leading products. Applied geometric dimensioning and tolerancing (GD&T) and tolerance analysis to ensure quality and manufacturability.Utilized ProE 3D CAD to design sheet metal, aluminum, plastics, die-cast, heatsinks, connectors, and cables.

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  Hewlett Packard Enterprise

  Aug 2012 - Mar 2020

  Director, Mechanical Product Development

  Direct a leadership team of nine direct reports and 100+ employees including Mechanical Engineers, Thermal Engineers, Electrical Engineers, Industrial Designers, Tooling Engineers, Packaging Engineers, EMC Engineers, Lab Technicians, Machine Shop Fabricators, and Program Managers located in the United States (70+) and Taiwan (30+).Execute mechanical and thermal architecture, development and design of a multibillion-dollar server, storage and rack infrastructure portfolio which includes tower and rackmount servers and options, storage, internet of things (IoT) products, rack and power infrastructure products.Lead product development operations with a budget of $11M including P&L accountability, forecasting, administration, mechanical/thermal architecture and design, management of test lab operations, and project management.Oversee the development of design specifications for mechanical, thermal, quality, industrial design, tooling, cosmetics, de-sign for excellence (DfX), and test guidelines resulting in improved project execution, quality, material cost, test results, and early identification and resolution of issues.Implemented cost control initiatives by driving design commonality, design to value (DTV), and reuse across portfolio of products optimizing cost and driving supply chain efficiencies resulting in a 5-10% material cost reduction each generation.Achieved $10.4M material cost savings across the two highest volume products by leading value-added engineering and design to value initiative in 2018.Build and leverage relationships throughout Asia with ODM design partners, component suppliers and contract manufacturers with onsite and remote interactions. Show less

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  Microsoft

  Mar 2020 - Jul 2020

  Director, XDM Hardware Engineering
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  Apple

  Aug 2020 - now

  Server and Storage Mechanical Development Leader