Ginna Permata Anggraeni

Experience

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  Kanazawa University

  Jan 2013 - Jan 2013

  Short Stay - Short Visit Program Kanazawa University

  An international exchange program to learn asic Principles of Semiconductor and Superconductivity and computational physics.

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  Physics of Material Electronics

  Feb 2013 - Oct 2014

  Quantum Semiconductor and Devices Lab

  Responsible for research on TiO2 material using Spectroscopic Ellipsometry tool.

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  Laboratorium Fisika Dasar

  Jul 2013 - Oct 2014

  Assistant Coordinator
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  Infineon Technologies

  May 2016 - Jan 2020

  - Lead Wire Bond, Plating and Autovision Inspection Process. - co-lead for Pre-Assembly and Die Attach Process. - Drive continuous improvement program on zero defect for NLoZD house on Top Defect Mode. - Corrective Action and Preventive Action deployment. - Responsible for Wafer Sawing and Die Attach Process. - Drive internal audit compliance. - Responsible for Wire Bonding Process (Thermosonic and ultrasonic bonding); Plating Process and Auto Visual Inspection Process.- Drive continuous improvement program on quality improvement.- Lead quality performance review- Method : FMEA, SPC,8D, 5Why analysis, Document Control, 7 QC Tools.- Ensure product quality and audit compliance. Lead Zero Defect Program through NLoZD house on Firewall Project.

  • Quality Engineer

    Mar 2019 - Jan 2020

  • Project Manager

    Jan 2018 - Jan 2020

  • Wafer Sawing & Die Attach Quality Engineer

    Jan 2018 - Feb 2019

  • Wire Bond Quality Engineer

    Dec 2014 - Jan 2018

  • Project Manager

    May 2016 - Dec 2017