Dragon Peng

Experience

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  Siliconware Technology (SuZhou) Limited

  Aug 2002 - Aug 2005

  TCP MFG supervisor

  1. Set up assembly & testing production line (Grinding ->die saw ->die attach->wire bonding->Molding->Laser marking->Plating->Trim&Firm->VM/ILB->Underfill->Testing->VM)2. Build up MFG team 3. Execute assembly line qualification 1. 建立工厂及生产线2. 组建培养制造团队3. 执行封测生产线的验证

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  AMD Technology(China)

  Sept 2005 - Sept 2012

  Senior Product Development Engineer

  1. ATE line issue(OCAP/low yield/abnormality) ownership2. ATE ownership to final yield/Test time/Insertion ratio 3. Test program releasing & management 4. Manage OSAT/factory focusing on FCBGA open/short/DCM 5. Support NPI activity(DVT/EVT/LVM/characterization )6. Technical contact window to product development /Fab/wafer sort/bumping1. 自动化测试生产线异常的负责人（低良率、质量偏离、突发事件）2. 自动化测试良率、测试时间、测试次数的负责人3. 测试程序上线和管理4. 管理安靠上海、槟城、槟城代工厂、苏州封装厂FCBGA开路、短路、崩缺5. 协助新产品导入（设计样品、工程样品、小批量生产、特性分析）6. 技术窗口：产品开发，晶圆制造和测试，长凸块，封装 Show less

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  AMD

  Oct 2012 - May 2018

  NPI PM(Assembly & Testing)

  Handle new product enablement from assembly to testing(full turnkey):1. Collaborate with global package/product development team to identify project milestone & timeline 2. Cooperate with supply chain & business unit for samples & IP volume 3. Drive factory cross functional team to achieve assembly/testing milestone 4. Lead package & testing qualification 5. Test program releasing & management 6. Dispose low yield/OCAP/abnormal issue 7. Pushing final yield/Testing time/Insertion ration improvement 8. Own system set up & apply: APQP & BOM & Camstar & SAP1. 对接国际封装、产品开发团队制定项目任务及时间2. 与供应链和市场部制定样品和前期量产出货计划3. 推动工厂相关部门协作准时正确地完成每一个项目任务4. 主导封装和测试的产品验证5. 测试程序上线和管理6. 处理产品的低良率，质量偏离和异常7. 推动良率，测试时间，重测率提升8. 系统建立和运用：APQP/BOM/Camstar/SAP Show less

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  Infineon Technologies

  Sept 2018 - May 2022

  Senior staff Product Engineer(IC)

  1. Dispose IC & FET wafer incoming issue & push FE for improvement 2. Release FT test program to production line for yield improvement & test time reduction 3. FT hold lot disposition & drive continuous improvement 4. Monitor Assembly & Testing yield and drive improvement 5. Support BE NPI from KO to MP focus on product data analysis & approval 6. Review SYL/SBL/test limit & implement change management 7. Act as product owner to RF product cooperating with cross functional team to achieve QCD8. Work with Fab /Assembly/testing/Quality engineering/Application engineering teams to solve customer quality issues and 8D corrective actions1. 处理 IC/FET 晶圆来料的异常并推动前道改善2. 通过新程序的上线达到良率及测试时间的改进3. 处理终测异常材料 并推动持续改善4. 监控封装测试的良率同时负责改善5. 后道新产品从立项到量产过程的数据分析及审批6. 定期评审良率 /测试项/测试参数 并做变更管理7. 作为射频产品负责人和多部门合作达到质量成本交期指标8. 和晶圆厂封装厂测试线质量部及运用团队一起应对客户质量投诉9. 同时独立地管理中国大陆的多家代工厂 Show less

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  国内芯片设计公司（>300人）

  May 2022 - now

  新产品导入项目经理+产品工程分析

  1. 参与新产品从MRD及设计到正式量产的全过程2. 主导新产品晶圆/封装/测试/打标/包装/出货的开发和导入3. 推动HTOL/ESD/Latch up/Reliability验证4. 审核晶圆制程参数/WAT/Corner wafer/Charz 5. 分析晶圆测试/终测参数和良率