Daniel Denisov

Experience

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  Intel

  Mar 2000 - Sept 2007

  Implant Equipment Tech

  Worked and supported Fab production In US and Israel.(FAB8,FAB18/FAB11/FAB12)Familiar and competent in high current and medium current implanters, from Applied Materials and Varian semiconductors.Got experienced with clean room enviroment and protocols, worked with different vendors and participated in a few cross traininig and support projects, related to new tools instalaltions and ramp upsPassed all required Intel, Applied materials and Varian courses and exams at the manufacturer's facilities. Show less

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  HP

  Sept 2007 - Jul 2008

  Field service engineer

  Hp Indigo devision.Digital press manufacturing and supporting customers around the world.

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  HP

  Apr 2009 - May 2012

  Remote support specialist HP Indigo Presses - EMEA Indirect (Channel partners) Tier 2

  Supporting HP's partner engineers remotely and with on-site visiting when required.Providing help during post sales process.Adaptation for the printing customer during ramp up.

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  HP

  Dec 2012 - Jul 2022

  Solving and leading E2E Software escalations on the press side - cross platform, commercial and industrial machines.Bugs reporting and analysis during the NPI/ beta process in the field when managing multiple accounts and working with program managers of different countries. Delivering a HW and SW solutions based on the logs analysis and KPI from software data. Supporting regional HW teams with press issues and remote press workstations PCand PLC HW/SW escalations at customer environment .Building and delivering training for the technical teams of the region. Show less Leading all technical activities in EMEA Indirect related to the new Series of Indigo Presses.Supporting distributor regional sales and the service business teams.E2E Technical handshake with a local HP Distributors before the installation implementation and ramp up of the new equipment..Working to support a smooth transaction from the introduction stage of the product toward the regular day to day operation.Managing KPI and customer feedbacks post instalaltion and helping with ramp up of the new technology Show less

  • World Wide Technical support Knowledge Team (Tier 4 escalation Competency Center)

    Sept 2021 - Jul 2022

  • Press Software specialist EMEA Technical Service Team (Tier 3)

    Sept 2016 - Oct 2021

  • HP Indigo EMEA GSS service specialist

    Jan 2015 - Sept 2016

  • EMEA Indirect Technical leader for series 4 Indigo Presses (Tier 2)

    Dec 2012 - Jan 2015
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  Applied Materials - Israel

  Jun 2022 - Apr 2024

  T3 SW Technical team support Applied Materials (PDC division)

  Providing a SW program and escalation support for the PDC tools in semiconductor industry WW.

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  BOBST

  Mar 2024 - now

  Software and Product Support Specialist with Narrow Mid-Web Printing & Converting