Sriram Srirangan

Experience

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  Alchemy - NIT Trichy

  Sept 2019 - May 2022

  • Chairperson

    Sept 2021 - May 2022

  • Co Head - Team Workshops

    Sept 2020 - Sept 2021

  • Manager

    Sept 2019 - Sept 2020
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  Seshasayee Paper and Boards

  Dec 2019 - Dec 2019

  Industrial Engineering Intern
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  National Institute of Technology, Tiruchirappalli

  Jun 2021 - Sept 2021

  Research Assistant
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  Georgia Institute of Technology

  Sept 2022 - Dec 2022

  Gradute Assistant

  Grader for the course MSE 4140 - Polymer Physics

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  Georgia Institute of Technology

  Apr 2023 - now

  Student Processing Assistant

  Worked on the following projects at the Institute of Electronics and Nanotechnology (IEN)1. Process Optimization in Deep Reactive Ion Etching (DRIE) Tools◦ Optimized the Si etch process in Deep Reactive Ion Etching (DRIE) tools to attain high aspect ratios and desired scallop dimensions.◦ Captured SEM images and characterized the process by analyzing trench depth, profile angle, and etch rates.◦ Tuned the process variables systematically to identify the ideal recipe for desired target features.◦ Achieved an aspect ratio 20:1 for 5 um features while maintaining scallop roughness below 200 nm.2. Metallization Calibration of E-beam Evaporators◦ Operated a range of E-beam evaporators to deposit various metals to calibrate the tool’s deposition process.◦ Performed lithography to yield 1 um features in order to simulate and analyze deposition in small structures.◦ Used a profilometer to measure thickness at multiple points across the wafer, assessing uniformity and rating the tool’s performance.◦ Applied Statistical Process Control (SPC) analysis on the collected data to identify any abnormalities in the deposition tools.3. Characterization and Defect Analysis on Epitaxial Films◦ Developed oxide and nitride films using three different CVD tools, calibrating them for optimal growth rate.◦ Employed a surf-scan tool to compare wafer conditions before and after film growth, identifying Light point defects (LPDs) and abnormal particulate growth or aggregation.◦ Utilized an ellipsometer to model film thickness, uniformity and refractive index by applying Cauchy and Sellmeier models and used the values to determine bow height and stress developed in the film.◦ Linked film characteristics to the specific CVD tool used for growth and presented them at the monthly review. Show less

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  Georgia Tech 3D Systems Packaging Research Center

  Aug 2023 - now

  Graduate Research Assistant

  Warpage and RDL Stress Analysis in Large Glass BGA Packages with Chiplet Integration◦ Spearheading process development for a large glass interposer (100 x 100 mm2) for HPC/AI applications.◦ Coordinating multiple test vehicles to characterize warpage, mechanical reliability and dicing characteristics to ensure optimal interposer performance and overall reliability.