TieGang Yang

Experience

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  MBO_DOUBLINK SOLDERS Ltd/ China

  Jul 2005 - Oct 2006

  Researcher

  Develop lead free alloy and flux on existing ingredients, to enlarge prescription database to suit manufacturing variants of electronic device in broaden process window.Key Accomplishments:Brought out Anti-dreg alloy with appropriate phosphorus, increase solders usability in waving soldering and dipping soldering;Setup manufacturing process control in solder material preparation process, such as lead free solder bar, solder wire, flux and paste.

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  FOXCONN PRECISION Ltd

  Nov 2006 - Oct 2007

  Product Quality Engineer

  Lead QIT activities to assure process quality by products, and define standard quality control procedures for material handling, SMD manufacturing and testing.Key Accomplishments:Succeed to launch three new RF modules to mass production under thorough process control, meeting the quality target defined by customer (Sony Erricson)

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  Nokia

  Nov 2007 - Feb 2013

  PTS(product technical specialist) ,support B-/ F- build preparation particularly on new technology & factory readiness, according to new product requirement; Lead factory cross functional team to manage technical risk & problem solving during LVRU & entire product life cycle; Sharing of factory lessons learnt with respective programs, leading to avoidable scrap cost during B- & PD build.Key Accomplishments:Analysis & propose for feasible solutions during Rainbow and EWP.Optimize factory resource make souring cost save on dome sheet assembly. SMD T-insert screw replaced by mechanical screw to solve the solder ability & reliability issues. Develop vacuum nozzle (used in torque driver) for non-magnetic screw, to improve pick-up efficiency. Continue support to sustain B-/F-build & LV/RU undertaken, lead the complex technical issue study and improvement to ensure the completions of PD2.5 for program undertaken, & follow up actions closure before PD3. Acting on behalf of Factory product manager during Factory build, able to complete the build as per scheduled. Resolve the top liner gap issue through collabration with marketing, supplier and program team to mutual agreement on gap lower and up limits.Study stronger springs and SIM shield Ni/Sn plating shield to solve SIM jam issue. Menu key capacitor position change to avoid scrap due to mechanic interference Show less Specialized on board assembly/final assembly process and product management during product life cycle, lead cross functional team to optimize process flow and work station to keep high product quality, low operation cost, and on time delivery.Key Accomplishments:Lean work station design and operating sequence optimization to reduce head counts and increase quality yield.Screw washer plating change from Au/Ni to Sn/Ni to build stronger joint to meet the request of screw torque.Stencil aperture optimization to enlarge process window for odd parts, such as RF shield, SIM reader, etc.DOE to trace out the main factors that effect to cycle time, to catch the optimized parameter setting;Lead product quality improvement with cross function team, to find fine pitch CSP printing and placement solution. Show less

  • Product Technical Specialist

    Sept 2010 - Feb 2013

  • Board/Final assembly Engineer

    Nov 2007 - Aug 2010
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  Sony Mobile Communications

  Mar 2013 - now

  TFC-GTT (Test Fixture Competence) buildup at Thailand factory and its Eco-system setup, bridging Japan, China, Thailand, among 2 design centers, 2 factories and different vendors at multi-country site, coach STT(Thailand factory) with design competence(ME, EL, SYS) , complete component sourcing transferring and manufacturing localization from China to Thailand.Key Accomplishments:1. Core of attention at ends of smiling curve as R&D and Locatization, to move the value at manufacture and delivery to both end, to realize Fast delivery, Lower cost, and Excellent quality.2. Enable creativeness design, global sourcing and competence government at R&D(globalization) and realize inheritance design, local manufacturing and vendor management factory site(localization); 3. Realize test fixture standard parts localization rate to 89% and equipment delivery lead time (design/manufacture/delvery/verification) reduction from 10wk to 8wk eventhough it's multi-national business. Show less Responsible for SMA DFM activities for all the products designed in R&D China, Continuously develop PBA design requirements to meet product requirements, securing the producibility and quality of Printed Board Assemblies for SOMC products from any development unit and at any production facility. Cooperated with e-CAD/ME /Factories team for those deliverables: footprint and aperture design rules, panel design rules, repair design rules, collection of factory feedback on producibility challenges, collection of factory and AMS repair feedback, updated design review checklist & SMA DFM checklist.Key Accomplishments:1. Develop and maintain the DFM & DFR processes; Provide inputs/updates to the PWB/FPC design rules2. Collect and share lessons learned on PBA design (e.g. from existing projects, teardown analysis, R&D requirements, etc.)3. Collect new design requirements after each project, lessons learnt from supply chain and update the PBA requirements after securing the production sites capability and readiness.4. JISSO PTRM developing items, refer to comparison between competitor and us at area of component, PBA layout, new techs.5. Overall production quality technical owner, factory handbook, quality standard, and technical related document creation, technical coacher for manufacturing site.6. Factories engineering enhancement globally. Show less

  • Senior Engineer of Indus Solution (Project Manager)

    Mar 2015 - now

  • Staff Engineer (Site Leader of PBA Steering)

    Mar 2013 - Feb 2015
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  Beijing Autoroad Technology

  Jun 2019 - now

  Director , Pilot Test&Productization Center