Experience

• 

  Selmic oy

  Dec 2001 - Jan 2013

  Bare-die specialist

  My main responsibilities was making prototypes in different kind of microelectronic devices example, sensors, COB, detectors, packaging etc. Wafer sawing, die bonding, wire bonding, encapsulation, machine programming and maintenance was also in my responsibility.

• 

  Detection technology

  Jan 2013 - now

  Responsible for Packaging and interconnection in R&D projects. Process development and optimization. Equipment programming: wire bonder, diebonder and dispenser. Mechanical design: product specific tool design (CAD).

  • Senior Assembly Process Development Engineer

    Sept 2021 - now

  • Process Development Technician

    Jan 2013 - Sept 2021