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Kumar Raja Kadali

Kumar Raja Kadali

Technician

Followers of Kumar Raja Kadali97 followers
location of Kumar Raja KadaliBengaluru, Karnataka, India

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  • Timeline

  • About me

    Technical Manager at HCL Technologies | HW infrastructure | Hardware LAB | Manual and Automation |

  • Education

    • SRBVN High School

      -
      SSC

      Sri Ravindra Bharathi Vidya Nikethan High School

    • Electronics Corporation of India Limited

      -
      National apprenticeship certificate Electronics 74%

    • Electronics Test and Development Centre

      -
      Zero defect soldering pcb assembly process 84%

    • ITI ELECTRONICS ( Industrial Training Institutes )

      2005 - 2007
      ELECTRONICS Radio & Television and Digital Communication 85 %

      Industrial Training Institute (ELECTRONICS)

  • Experience

    • ROLEX TECHNOLOGIES PVT. LTD

      Aug 2005 - Sept 2006
      Technician

      Assembling of Energy Meters.Assembling of Axiom SMPS Cards.Involved in Inspection of G5 (Grade 5 level Inspection).Assembling of DANLAW Power supply Cards.

    • Electronic Corporation Of India Limited.(Ecil)

      Oct 2006 - Mar 2010
      NSIC Trainee

      Assembling of different SMD components, IC packages of TQFP, QFP, SOP, DIP. Assembled Modules namely ECCM, Control Card, Base Band Processor, UDC Module, Synthesizer, Harmonic Filter, RF Control, Processor etc.Involved in Rack Integration of UHF SATCOM and M7 Radio (Cable Routing, Assembling of Units in Rack). Connectorisation of RF Cables (RG & RJ 316, RJ 216, RJ 223), Cat 5e- Cables (RJ48, RJ45, RJ11, RJ9) and Sucoform cables.Assembling of Sensing Receiver PCB, EVM PCB’s in Ballot unit and Control unit,Energy Meters.Attended field work in EVM units and Serviced EVM units with critical problems Show less

    • HBL Power Systems Ltd.

      May 2010 - Oct 2010
      Senior Technician

      Manual Soldering of CPLD (Ultra fine Pitch), BGA, CLCC, TQFP, QFP, SOP, DIP, Chip Resistors and Chip Capacitors.BGA balling, reballing, mounting and reworks.PCB Rework: Serpacks, IC bases and connectors.Chassis wiring of the entire unit

    • Avantel Limited

      Oct 2010 - Nov 2013
      Senior Technician

      BGA balling, rebelling, mounting and reworks.Manual Soldering of CLCC, TQFP, QFP, SOP, DIP, Chip Resistors Packages 0402 to 1206 and Chip Capacitors.SMD solderings Resistor Packs, Melf diodes, flash ICs, J Leaded IC’s.Fine pitch IC’s, Mictor Connectors, all types of Connectors, Flash Sockets. PLCC Sockets, Crystals, SO ICs, SROM, and critical wirings

    • Eruvaka Technologies

      Jan 2014 - Dec 2014
      Senior Lab Engineer

      Manual Soldering of CLCC,TQFP,QFP, SOP, DIP, Chip Resistors Packages 0402 to 1206 and Chip Capacitors.Hardware troubleshooting, Debugging of electronic circuits, Fallow the Schematic and BOM’s. Managing Production department and quality control

    • Polycom

      Dec 2014 - Dec 2015
      Hardware Technician

      SMD fine pitch components Soldering, Testing and Troubleshooting, High Speed PCB’s and Rework of Complex PCBs, Fallow the Schematics and BOM's,Identifying of Design Issues, Sporting Engineering Teams Development Platform, Core, UI, UX and SQA Manual, Automation,Maintenance of R&D lab, Debugging of electronic circuits.

    • Sensworx Systems

      Jan 2016 - Jun 2018
      Technical Support Lead

    • HCL Technologies

      Jul 2018 - now
      Technical Manager

  • Licenses & Certifications

    •  Certified from ETDC on Zero Defect Soldering Based on IPC Standards

      Entrepreneurship Training & Development Center (ETDC) JLT