Sei Ibrahim

Experience

• 

  IBM

  Jul 1995 - Oct 2000

  Process Engineer

  Extensive research experience developing multiple processes technologies for copper, nickel, gold and palladium modules at International Business Machines (IBM’s) tape-ball-grid-array (TBGA) carrier development facility and successfully transferred to high volume manufacturing sites in USA/Canada

• 

  Intel Corporation

  Oct 2000 - now

  Expatriate engineering manager working in Dalian, China for Intel semi-conductor (Dalian) Ltd managing a team of technical leaders responsible for guiding the process and integration engineering members to transfers 65/90nm process technologies from facilities in Chandler, AZ and Dublin, Ireland. Responsible for managing the evaluation, qualification and successful implementation of all process technology changes in order to meet factory wide strategic objectives around cost, quality and output Show less

  • Sr. Director - NAND Process Integration TD

    Apr 2019 - now

  • Technology Development Area Manager

    May 2018 - Apr 2019

  • Engineering Manager - Intel-Micron Joint Development Program

    Apr 2016 - Apr 2018

  • Technologist

    Apr 2015 - Mar 2016

  • Engineering Team Lead

    Feb 2014 - Mar 2015

  • Engineering Manager

    Oct 2008 - Feb 2014

  • Engineering Manager & Individual Contributor

    Oct 2000 - Oct 2008