Experience

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  Micron technology

  Aug 2007 - Aug 2017

  Senior process engineer

  My role as the team leader in start-up of major projects like the technology transfer and implementation of continues improvement project (CIP) of Ion implantation process and CMOS integration projects, product defect reduction and establish Big Data system for better process and in-line manufacturing process control.My main scope involves oversee Implant process control (SPC), project management on new tools qualification and new product introduction within stipulated timeline, and drive Process improvement project for yield, defect and quality.I am professional at design of experiment (DOE) for product characterization, and conducting training for new improvement procedures and product introductions to all levels of organizations. Strong problem solving skills to identify problem statement of issues, perform analysis, provide corrective and preventive actions and monitor for improvement and recovery, and developing recipe conversions for production efficiency, cost savings and quality improvements.I'm also a team player in various collaboration with engineers from other departments and vendors in equipment troubleshooting, process and production problem solving.Key Accomplishments:-Implant project leader to build & start-up the implant feed-forward system to compensate incoming wafer lithography CD and diffusion dielectric (oxide) thickness variation successfully with ~2% drive current Cpk improvement on DRAM and NAND device.-Implant project leader to qualify and implement medium current CIP Superscan (1 and 2) into production as POR with ~0.5% yield improvement average. And implement Fault detection (FD) system successfully for Superscan control. Show less

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  Applied materials

  Oct 2017 - Dec 2019

  Process support engineer manager

  I led and manage a team of Process Support Engineers in Applied Materials to support 3D NAND HVM and TD (ion implantation and thermal process) for Intel Fab68 (DMTM). I was in charge of engagement with Intel TD team, to understand resolve customer HVP (High value problem), and provide advance (n+1, n+2) tech node processes solution in 3D NAND development through collaboration with HQ. In addition, to drive TCO (total cost of ownership) down to achieve customer cost saving goal (commercial and technical). Conduct training for new improvement procedures and product introductions to all levels of organizations.Key Accomplishments:-Winning Intel Supplier of the Month (SOTM) in 09/2018 for outstanding performance in Ion implantation tool release support for Intel F68 tango Fab extension. Show less

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  Institute of microelectronics

  Mar 2020 - now

  Senior research engineer ii