Simon Lee

Experience

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  Particle Engineering Research Center (PERC)

  Jan 2007 - Dec 2010

  Research Assistant

  • Modified Sol-Gel Synthesis of High Aspect Ratio Nanoparticles (PERC)TiO2 and vanadium doped titania nanoflakes for photoassisted water purificationNi(OH)2 nanosheets as cathode materials for NiMH batteries• Surface Modification of Nanoparticles (PERC)Applied electroless nanoscale silver coating on titania nanoflakes through controllable reductionEnhanced nanoparticle dispersion and dissemination by self-assembled long carbon chain silane• High Energy Milling ProcessParticle size reduction of Ni(OH)2 and hydrogen storage alloy powders using the attrition mill for high-power battery systems (G4 Synergetics, LLC)Development of high aspect ratio metallic flakes inmechanical comminution process• CO2 Assisted Supercritical Drying (SCD) Process (Particle Systems, LLC)Established a supercritical fluid apparatus and executed SCD of metallic and ceramic nanoflakesPore size and distribution control of high specific surface area titania aerogel for catalytic application Show less

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  Innolux Corp.

  Apr 2011 - May 2012

  Senior Engineer

  • Utilized polarized light microscopy to identify the formation of bubble mura defect to significantly reduce the cost of inspection by 70% resulting in a year savings of 1 million1. Performed interfacial failure analysis of laminated composites in the liquid crystal display (LCD) devices under the extreme aging condition2. Participated in the project “Outgas analysis of layered materials in the LCD devices at high temperature”

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  Cabot Microelectronics Corp.

  May 2012 - now

  Research And Development Scientist

  • Designed and developed new generation CMP platforms for TSMC FEOL/MOL advanced logic Tungsten: tungsten gate and contact (POR in 5/7/10 nm nodes)Cobalt contactCopper/Barrier: Cu, traditional Ta/TaN, Ti/TiN and advanced Co liner Dielectric applications: Advanced oxide/nitride/poly-SiHigh K (HfO2 and ZrO2)• Promoted and improved Through-Silicon Vias (TSV) CMP platforms including frontside and backside applications for TSMC and Infineon advanced 3D packagingFrontside: TSV nitride/carbide (POR in 65 nm TSV)Backside: TSV oxide/copper, TSV silicon/copper (POR in Infineon TSV), and silicon thinning• Established high end tool analyses for particle and surface characterizationsIn-Situ Liquid TEM (Innovation Award Silver, 2018) Show less