Brian Lynch

Experience

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  EM Microelectronics

  Jun 1987 - Sept 1990

  Program manager

  Installation and characterization of complete Au wafer bumping line Development of 100, 125, and 150-mm straight wall bump processes Creation and updating of production process specifications

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  EM Microelectronic

  Jun 1987 - Sept 1990

  Program Manager

  Wafer bumping, photolithography engineer

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  Wafer Bumping

  Mar 1989 - Jul 1989

  Project Manger

  Rebuilding of destroyed wafer-bumping areaEquipment evaluation, identification, selection, and characterizationSecond wafer bumping source identification and qualification

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  LSI Corporation

  Oct 1990 - Oct 1994

  Senior Semiconductor Packaging Development Engineer

  Evaluated various flip chip interconnection and package constructionsAssessed cost, reliability, manufacturability and meritDeveloped wafer bumping and assembly processes w/ various subcontractorsIntegrated interconnection solutions w/ Si and package designs for customer applicationsManaged all technical aspects of the package w/ supplierInterfaced with end customer to optimize package electrical performanceCreation and updating of process and package specifications

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  Amkor Technology

  Oct 1994 - Sept 2015

  Laminate Products Business Unit 12/12 to PresentP&L responsible for a ~$700 M product line manufacturing in 4 Asian countries and 6 factories for ~100 international semiconductor companies.Managed CapEx expenditures of $100M+ annuallyBusiness Management, Administration, and Pricing 3/05 to 12/12Responsible for pricing and business administration for a $2.7 B international high technology corporation supplying services to the world's top semiconductor companiesImplemented a systematic approach to quote, bill, and collect for customer requested operations and pass through commodity price increases.Led a team of multi-nationals implementing SAP (Sales and Distribution module) in our largest factories in Korea and PhilippinesLed a team of 5 pricing professionals providing over 5k of RFQs annually to over 250 customersEstablished a core team of quote and billing experts to facilitate the customer quote processWorked with sales, business units, finance, ICS, legal, auditing (internal and external) groups, and the factory on various contracts, agreements, and dispute resolutionsWorked with several major customer's e-business processes to improve time to cashDeveloped work flows and processes to ensure compliance to SOX 404 revenue compliancy Show less Leadframe and Hermetics Business UnitResponsible for understanding customer end markets and alignment of corporate resources for a $850 M businessFinancial analysis and justification of major product lines expansions to maximize corporate ROIAnalysis of future factory costs to determine corporate direction in new factory locationsNegotiation with major customers to internalize their assembly and test operationsIdentification and negotiation with Chinese domestic assembly houses to acquire assets Show less Responsible for all aspects (P&L, technical, and development) of a $260 M businessEstablishment of corporate roadmaps, resource allocation, capacity installation timing and rationalization, payback analysis, factory consolidation, and justification in 5 factories located in Korea, Philippines, Japan, and TaiwanImproved operating profit through material cost reduction, asset re-deployment, process simplification and non-value added process eliminationInterfaced with many multi-national customers to establish product requirements, cost targets, and production needs for the company's most diversified product offeringWorked with several international suppliers to establish design rules, process flows, and material sets which resulted in significant improvements to product cost, performance, and reliabilityVoting member of Amkor's patent council and active participant in quarterly supplier negotiations Show less Responsible for all aspects (P&L, technical, and development) of a $165 M businessEstablishment of corporate roadmaps, resource allocation, and capacity installation timing, rationalization, payback analysis, and justification in 2 factories located in Korea and PhilippinesInterfaced with many multi-national customers to establish product requirements, cost targets, and production needs for the most thermally and electrically demanding customer's devicesWorked with several international suppliers to establish design rules, process flows, and material sets which resulted in significant improvements to product cost, performance, and reliabilitySupervised and directed the activities of several product engineers Show less

  • Sr. Vice President

    Oct 1994 - Sept 2015

  • Sr Vice President

    May 2004 - Mar 2005

  • Vice President

    May 2002 - May 2004

  • Vice President

    Feb 2000 - Jun 2002

  • Director - Advanced BGA Products

    Oct 1994 - Feb 2000
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  Self Employeed

  Sept 2015 - Aug 2016

  Indendent Consultant

  Consulting on OSAT space and advanced semiconductor packaging

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  AT&S Americas, LLC

  Aug 2016 - Mar 2022

  Key Account Manager
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  MacDermid Alpha Electronics Solutions

  Mar 2022 - now

  Director, Strategic Accounts