Vemmond Ng

Experience

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  Shell Eco – Marathon Asia 2014

  Jan 2013 - Feb 2014

  Brakes and Wheel Department Head for Urban Concept Category

  - Exchanged ideas with different departments to tackle design problems and successfully integrated all systems to become a working vehicle.- Designed a new and unconventional braking system.- With neophyte status, managed to defeat more experienced teams and emerged as finalist among 120 participating teams across Asia.

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  Monash Science Club

  Jan 2013 - Jan 2014

  Vice President

  - Planned and organized one day trip to PetroSains (KLCC) and 5th Putrajaya Hot Air Balloon Fiesta 2013.- Maintained the list of residences, email addresses, student ID numbers and phone numbers of the clubs’ officers and members.- Prepared yearly budget as well as responsible for monitoring the expenses and ensuring the projected figures are met.- Assisted the President with the oversight of the organization including fundraising and event planning.

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  Engmech Venture Engineering Sdn Bhd

  Dec 2014 - Feb 2015

  Industrial Trainee (Project Management)

  - Designed concepts and products under non-disclosure agreements for customers with cross functional design teams that include Mechanical and Product Designers.- Arranged for logistics and led a team of eight workers for the removal of old equipment and installation of its replacement within the given time frame.- Prepared cost estimates and proposed the pricing of new products for customers.- Responsible for recording and maintaining engineering records and meetings minutes.- Responsible for other duties as assigned by supervisor.- Was praised for outstanding achievement in designing and project management area. Show less

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  Runway Designer Outlet

  Jul 2015 - Aug 2015

  Part Time Sales Assistant and Cashier

  - Worked as both retail assistant and cashier, depending on event organizer’s needs.- Actively involved in event management – planned, coordinated and supervised sale-related activities.

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  Young Engineer Rotation Program Boot Camp

  Apr 2016 - Apr 2016

  Participant

  - In-depth training in the area of leadership, critical thinking, problem solving and communication skills.

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  ON Semiconductor

  Aug 2016 - Feb 2022

  - Prepare & review all technical drawings for all jigs & materials, package outline, new package design layout.- Technical swim-lane owner & project leader for Next Generation SSDC Package.- Managed & led new package platform development process (package design stage to mass production release), particularly for Power Module Package - both SSDC & PIM package (IGBT / Mosfet).- Co-leader for special task force team to improve assembly yield for SSDC package.- Re-structure SSDC / PIM package handling instructions to customer, particularly for press fit pin & soldering pin application.- Solved 'snake/crack' void from 2nd Vacuum Reflow Process on Si3N4 AMB for SSDC package.- Nominated and selected to participate '2020 China Manufacturing Leadership Development Program' & 'SME Development Program' - 5 Patents filed on Power Module package related.- Technical discussion on Press-fit application & PCB issues related Show less - Core team member for design and development of New Automotive Power Module (particularly in Single Side Direct Cooling - SSDC) for both IGBT and SiC Mosfet version.- Attended High Level Technical Meeting for SiC Mosfet Die Level Design and Automotive High Power Module in Bucheon, Korea.- Provide guidance & support to ON Semi-ShenZhen for SSDC Build.- Provide guidance & support on DSC prototype build, particularly on Vacuum Reflow Soldering Process.- In depth study & developed new reflow approach for 2nd Vacuum Reflow Soldering Process for Automotive Package. Show less - Developed electronics packaging production processes (particularly in Power Integrated Module-PIM) such as vacuum reflow soldering, gel potting, curing, case attach and solder printing.- Developed and conducted statistical analysis such as Design of Experiments (DOE) targeting process optimization and high yield process controls. - Troubleshooting equipment failures - root cause investigation of discrepant material and implementation of yield improvement programs.- Recommended and implemented equipment and process modifications to improve production efficiency, production yield, product quality and cycle time for existing products and processes. - Provide technical support to all engineering and provide support to manufacturing and implementation processes of product packaging.- Liaised with design engineers to ensure that processes and designs are compatible and optimized for future products.- Qualification of new tools as well as identifying and qualifying new materials suppliers. Show less Engineer Rotation Program (ERP) is an one-year rotation program that educates the engineers on every aspect of the ON Semiconductor's manufacturing line by placing the engineers on four various assignments (three months per assignment) in each department. In each rotation, a mentor will be paired with the engineer to provide guidance, tasks, assistance and assessments.1st Rotation:Role: Manufacturing Equipment EngineerDepartment: Probe & Die SalesProject Title: Machine Related Scrap Reduction on EG2000 Prober- Studied and analyzed the root causes of the machine-related wafer broken issues. Designed and assembled improved machine parts and tools to treat root causes. Successfully reduced 70% of broken wafer issues from 26 cases to 8 cases per work week.- Modified the crescent with new material and design to solve material-related issues for certain specific devices.2nd Rotation:Role: Process EngineerDepartment: SOSM Front-End (Die Bond - Eutectic)Project Title: Comprehensive Process FMEA (CPFMEA) for CAS Task Force - Core team member in developing the new CPFMEA for SOSM Die Bond - Eutectic process.- Possesses sound and thorough understanding of the entire process of Die Bond.- Developed the SIPOC, Potential Failure Modes & Effects, Why-Why Analysis, RPN Rating, Current Prevention & Detection Method and Recommended Actions.3rd & 4th Rotations:Role: Package Development EngineerDepartment: PIDC/PIMProject: Power Integrated Module Gen III Development- Designed and developed two new processes for Gen III (DOE, working instructions, process specification).- Developed MQC of 4 processes and their process specification for the safe launch of Gen III.- Successfully identified and solved ‘Ghost Void’ issue prior to the safe launch of Gen III. Show less

  • Senior Package Development Engineer

    Oct 2019 - Feb 2022

  • Package Development Engineer - Engineer II

    Apr 2018 - Oct 2019

  • Package Development Engineer - Engineer I

    Aug 2017 - Apr 2018

  • Charity & Event Main Committee

    Aug 2016 - Mar 2018

  • ERP Engineer (Engineer Rotation Program)

    Aug 2016 - Jul 2017
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  GEELY

  Mar 2022 - now

  电控硬件设计主管工程师

  - Develop & define full sintering process flow for EMC power module package type, particularly for SiC Mosfet platform.- Prepare & review technical drawings for all materials and package layout.- Sourcing & lead technical discussion with all material suppliers.- Research & study on GaN related applications.- 1 patent submitted on power module package design related.- Provide workshop on DFMEA and Power Module Package Design & Process Flow to team member.