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Clive Bicknell

Clive Bicknell

Industrial Placement Student

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  • Timeline

  • About me

    Etch Process Technical Leader at Intel Corporation

  • Education

    • Liverpool John Moores University

      1988 - 1992
      Applied Chemistry Applied Chemistry 2(ii).

      Activities and Societies: Scuba diving (equipment officer) 4 year Applied Chemistry degree including 1 year working in industry. For my industrial year I worked at Shell Petrochemicals, Ellesmere Port working on advanced lubricant oil additives (calcium/magnesium salicylate additives).

    • University of Liverpool

      1992 - 1993
      MSC Surface Science and Catalysis Surface Science and Catalysis Pass

      Activities and Societies: Scuba diving (university group).

    • Nottingham Trent University

      1993 - 1996
      PhD The Role of Rhodium in the Andrussow Process Pass

      Activities and Societies: Scuba diving (university club) Major challenges of this project included the design and construction of a lab reactor to study this reaction to study the effect of varying the rhodium concentration of the catalyst. Techniques used include Scanning Auger microscopy, XPS, TOFSIMS, gas chromatography with quadrupole mass spectroscopy sampling for peak determination.

  • Experience

    • Shell Petrochemicals

      Oct 1990 - Sept 1991
      Industrial Placement Student

      During my industrial placement year I worked at the Shell Stanlow refinery at the Technical Development Chemicals Laboratory. I worked on process optimization of the manufacture of alkyl-salycilate lubricating additives (Shell SAP additive products).

    • Leverhulme Centre for Innovative Catalysis

      Jan 1996 - Jan 1997
      Post Doctoral Research Assistant.

      On completion of my PhD at Nottingham, I returned to Liverpool to work as a post-doc researcher working for Éric Derouane at the Leverhulme Centre for Innovative Catalysis. During my time as a post doctoral researcher I worked on multiple sets of equipment and processes, both as part of my own research project and to help other people in the laboratory.

    • Tokyo Electron

      Jan 1997 - Aug 2001
      Install and Field Support Engineering

      Beginning in 1997 I joined a team of install specialists performing semiconductor process equipment installation and set-up according to customer needs. During this work, accuracy and attention to detail were paramount in ensuring that the equipment installed was of the highest quality and completed on time.

    • Intel Corporation

      Jun 2002 - now

      Etch Group Technical Leader. Responsible for (1) working with a group of etch process engineers to ensure overall process segment health (2) Performing deep-dive into process equipment operating parameters to identify potential run-rate / process capability / defect performance / cost improvements. My current role as a senior process engineer at Intel Fab 28 exposes me to a myriad of challenges on a daily basis, including SPC targeting, tight defect control ensuring meeting or exceeding cost targets and meeting availability targets.Through my deep knowledge of the equipement, working with the equipment vendors

      • Technical Leader

        Jul 2020 - now

      • Senior Process Engineer

        Jun 2002 - now

  • Licenses & Certifications