Ferdz M.

Experience

• 

  Cypress Semiconductor Corporation

  Aug 2004 - May 2016

  Yield Engineering (CCD BU - Overall champion):- Driving Assy, Test, & Finish (ATF) yield analysis and improvement for Legacy and New products to 99%Product Engineering:- Qualifications of new devices (NPI): device tape out and mass production release- QFN SPC member: Yields and Quality Improvements- Device/Product's Test program review, qualifications, and release Wafer Sort Process Sustaining Engineer- Manages wafer sort/probe process at Subcon houses- Qualifications of new Subcons for wafer sort/probe- Provides lot analysis and dispositions- Drives wafer sort yields and quality improvement initiatives Back-End Test Product and Sustaining Egineer:- Team Lead: Yield Engineering (CCD BU)- Device owner of Post PR5 and Legacy parts- Drives Quality and Yield improvement activities- Provides lot analysis and dispositions thru MRB: interim and permanent fix

  • Product Engr Sr.

    Dec 2012 - May 2016

  • Wafer Sort Process/Product Engineer

    Oct 2008 - Dec 2012

  • Product Engineer

    Aug 2004 - Oct 2008
• 

  ASE Group Global

  May 2016 - Dec 2018

  PTE (Product Test Engineer)

  PTE (Product Test Engineer):- Mainly supports customer driven projects and initiatives globally- Main customer account: Cypress- Other accounts includes: Microchip/Atmel, other US based customers

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  Micron Memory Taiwan Co., Ltd.

  Jan 2019 - Mar 2023

  External Mfg. Engineer (OSAT) - Test and Failure Analysis

  • Perform electrical failure analysis for test failure components.• Follow up with subcon or internal FA team to provide completed failure analysis conclusion of test failure components.• Co-work with test program, hardware, product engineering team to stablish test infrastructure in subcon.• Provide support in product proliferation or qualification of test activities in subcon.• Drive continuous improvement projects in subcon test processes to improve yield, equipment/hardware maintenance, operational efficiency and productivity.• Support QA line audit.• Investigate and provide 8D report for test related issues escalated from internal or external customer.• Manage changes (new material, new equipment, new process, subcon PCN)FA ENGINEER (Module and Component): ◦ Responsible EFA and validations for module and package parts: Bench ATE validations ◦ Low yield (module) lot validation, Failure Analysis and isolation ◦ Provides lot disposition based on the EFA results Show less

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  Rambus

  Mar 2023 - Apr 2024

  Senior Test Mfg. Product Engineer

  • Bring-up and debug 1st Si quickly to identify any potential design, process, or testing flaws/issues.• Perform yield analysis to ensure product meet yield projections and output.• Identify low yield detractors and root cause.• Working with Taiwan and Korea OSAT houses to ensure smooth production for both wafer sort and final test on day-to-day basis: tester correlation, hold lot disposition, etc.• Identify areas of improvement in current production processes• Drive/support TTR activities to improve/increase manufacturing productivity and output. Show less