
Muhammad Faizul

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About me
Manager, IC Packaging Engineering, Product Technology, Development & Integration
Education

International Islamic University Malaysia
2007 - 2012Bachelor's degree Materials Engineering
SMK Abdullah Munshi
2000 - 2004SPM Materials Engineering
Experience

AMD
Sept 2012 - Mar 2014• Ball Mount Process • Designs, modifies and manages activities for specific products from product definition, planning and implementation through production and release.• Involvement last throughout all stages of a product’s lifecycle from product release through maintenance of a product and end of life decisions.• Sustain Ball Mount process which included Ball attach, reflow oven, flux cleaning and VM manual inspection.• Handle and manage ball pull and ball shear machine (Dage 4000) • Involve in cost saving project.• Work on defect reduction to ultimately improve VM yield and assembly yield through collaboration with manufacturing, process and equipment teams.• Provide root cause solutions and implementation of preventative measures to prevent re-occurrence of similar issue.• Responsible for yield analysis and process support as well as monitor process yields throughout the line.• Prepare & review SPC control limit chart quarterly.• Carry out experimentation, process capability studies, or other technical evaluation to improve yield and quality.• Working directly with QE team for any outgoing quality issue.• Participate in purge and MRB meetings to ensure proper disposition of discrepant material.• Perform continuous improvement or Kaizen activities for productivity, quality and yield.• Conduct buy-off procedures of new equipment or qualification of new material.Involvements/Accomplishments: • Deputy 1 for package chip reduction task force for BGA product which successfully drives down package reject from 1500 ppm to 150 ppm.• Successfully reduce Ball Mount rework PPM from 1500ppm to 152ppm with implemented several process improvement.• Successfully reduce machine downtime/set up time from 11% to 2% after implemented universal/standardize reflow profiling for every product.• Implemented PCS (Process Control System) for ball mount process. Show less
Product Development Engineer
Sept 2012 - Mar 2014Product Development Engineer
Sept 2012 - Mar 2013

Osram Opto Semiconductors
Mar 2014 - Jul 2016R&D Product Steering Development Engineer• Conduct optical steering and provide relevant steering analysis or improvement for new device.• Involvement last throughout all stages of a product’s lifecycle from product definition (feasibility study,(Q1)through product release(Q5) and maintenance of a product and end of life decisions).• Perform steering related continual improvement project, relevant manufacturing process optimization.• Technical support and interface for any steering related improvement topics between R&D process team and production where necessary.• Support new phosphor introduction with proper steering investigation and relevant device level characterization per new application need• Establish, sustain and review daily visual mechanical scheme at production floor for fast feedback, data collection and analysis Show less

Western Digital
Jul 2016 - nowNPI Technical Project EngineerJob Scope:1) Concepts and Planning.-Evaluate new concepts, package design, technology and etc.-Lead mechanical and functional characterization based on risk assessment.-Decide which design suitable to run in SDSM based on DFM, PDW.2) Development.- Setup Process Flow based on stack up diagram, design rule and BD.- Ensure all the DM&IDM material in house for mechanical sample, engineering sample, customer sample and package qualification.-Lead package qualification and reliability process.- Lead yield and quality improvement activities during NPI stage.- Update all documents (SOP/OCAP/FMEA) during end of qualification.3) LVM and HVM Support.- Lead LVM build, monitor yield and perform LVM lesson learnt.- Drive yield and quality improvement activities during LVM stage- HVM – monitor first 100K yield performances.- Support sustaining team in yield Improvement and any process changes required. Show less
Manager , IC Packaging Engineering , Product Technology ,Development & Integration
Apr 2022 - nowStaff Engineer , Product Technology , Development & Integration Engineering - Technical Project Lead
Jan 2020 - Apr 2022Senior Engineer , Packaging Engineering -Technical Project lead
May 2017 - Jan 2020Engineer II , Packaging Engineering ( Technical ProjectLead )
Jul 2016 - May 2017
Licenses & Certifications

BEM

Lean Six Sigma Black Belt (ICBB)
Penang Skills Development CentreNov 2017
Languages
- enEnglish
- maMalay
- taTamil
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