
Chein Ee Ong
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About me
Product Development, Manufacturing Test Development, Failure Analysis, NPI, and Security Fuse Test Development.
Education

Universiti Tenaga Nasional
2011 - 2016Engineer’s Degree Electrical and Electronics Engineering First Class HonourActivities and Societies: SCA Career Ambassador Team Final Year Project:Intelligence Street Light System by using self-construct Microcontroller System

Universiti Sains Malaysia
2016 - 2017Master of Science - MS Microelectronic EngineeringResearch in:EXPLORING HIGH RESOLUTION TEST PATTERN TO IMPROVE THE CACHE FAILURE ANALYSIS
Experience

Intel Corporation
Mar 2015 - May 2015Internshipproviding support for Intellectual Property(IP), Pre-Silicon analog circuit design, to ensure the implementation of feature sets in the final product

Intel Corporation
Jan 2016 - Jan 2019Failure Analysis R & D EngineerPerforming failure analysis and root cause analysis on Intel CPU, Chipsets and Netcomm platform products. Including PC system, tester testing and analysis to isolate the failing instruction and internal signal. Applying circuit analysis and various device localization equipment and techniques to localize the failing circuitries and performing physical failure analysis to locate the defect.Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in FAB, assembly and stress test for root cause fix. Participating in new product or technology transfer and start-up, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites. Show less

Infineon Technologies
Jan 2019 - Jan 2020Process Integration EngineerHandle the process, inline data monitoring, PCM data, product test & yield issues in wafer fabrication process. Continuously feedback and support in new product transfer/development stage to meet the yield target & product reliability.Investigating in yield issues & feedback to process line for improvement. Participate the technology development in term of process integration perspective, carry out the process DOE (such as implant/etching/lithography/thermal process) for yield improvement to meet customer target spec. Analyze the final test data/stress test data from DOE data output, formulate/ perform regression analysis to fine tune the process flow in term of meeting the customer requirement.Working closely with counter parts on process improvement topic, inline excursions, root cause finding and provide working solutions to the production line. Show less

Intel Corporation
Jan 2020 - nowProduct Development EngineerResponsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Make significant contributions to design, development and validation of testability circuits.Evaluation, development and debug of complex test methods. Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment. Creates and tests validation and production test hardware solutions. Tests, validates, modifies and redesigns circuits to guarantee component margin to specification. Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability. Analyzes early customer returns with emphasis on driving test hole closure activities. Creates and applies concepts for optimizing component production relative to both quality and cost constraints. Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and judgment. Show less
Licenses & Certifications

Product Security White Belt Certification
Intel Corporation- View certificate

PSG-P New Inventor
Intel CorporationJul 2021 
Professional Technologies
Malaysia Board of TechnologistsDec 2020
Honors & Awards
- Awarded to Chein Ee OngDepartment Recognition Award MDNA Intel Mar 2024 in recognition dedication, collaboration and execution with the project DFX validation team in task force mode. As result, the efforts successfully put the project milestone back on track and meeting the milestone requirements.
- Awarded to Chein Ee OngDepartment Recognition Award MPE Intel Nov 2023 in recognition of successfully enabling the 1st Intel SOC Security Protocol on High Volume Manufacturing product. This implementation is winning key design and shipment to broad market segment.
- Awarded to Chein Ee OngDepartment Recognition Award CAG Intel Mar 2022 Pull in sample enabling plan and recommitted it to support the customer requests by 2 weeks ahead of the original schedule.
- Awarded to Chein Ee OngFinalist Intel Culture Hero Award DPG Intel May 2021 Recognition as a role model for intel core values in multiple areas such as fearless, one intel & quality, by picking up challenging task & constantly contribute to innovation paper.
- Awarded to Chein Ee OngBest Innovation Story PSG Intel Dec 2020 Innovatively enhanced test pattern conversion flow for external IP which makes the tester more debug friendly.
- Awarded to Chein Ee OngTechnology Innovation Intel PSG 2020 Develop a modular rapid test methodology for die performance monitoring test. Through use of this BKM, nearly 50% simulation time was saved during pre-silicon stage, providing flexibility and simplifying the manufacturing test setup process.
- Awarded to Chein Ee OngLab Link Award Intel QnR 2018 Team with amazing people in established an innovation mythology in producing MBIST cache FAFI collateral files, this will shorten the waiting time to perform cache failure isolation and increase the efficiency.
- Awarded to Chein Ee OngDepartment Recognition Award Intel QnR 2017 Root cause on the failure that related to the reliability issues. Based on the finding result, company able to cut off about a billion of losses and restored the external customer confidence level toward the company.
Volunteer Experience
Branch Youth Council Chairman
Issued by Malaysian Red Crescent on Apr 2023
Associated with Chein Ee OngPresident
Issued by Red Crescent Youth on Jan 2005
Associated with Chein Ee Ong
Languages
- enEnglish
- chChinese (simplified)
- maMalay
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