Ik Yeng Teo

Experience

• 

  Flextronics International, Melaka

  May 2005 - Aug 2006

  Test Engineer

  Main responsibilities:• Handled In-circuit Testing (ICT) and Functional Circuit Testing (FCT), Printed Circuit Boards debugging using HP3070 tester, false rejects reductions in the productions, ICT and FCT fixtures daily preventive maintenance, testing yield monitoring• Responsible in New Product Introduction (NPI) for Hewlett Packard products.• New ICT and FCT test fixtures buy off.• Long term preventive maintenance of the test fixtures• Involved in cost reduction projects such as evaluation for the second source for test probes and solder paste. Show less

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  Infineon Technologies

  Aug 2006 - Feb 2009

  Reliability Engineer

  Main responsibilities:• Coordinated and monitored the incoming and outgoing Front End Product Qualification projects from the Germany and Austria counterparts.• Monitored the quality of the various reliability tests for the product qualification projects.• Monitored the fulfillment of the overall product qualification and stress tests cycle time.• Daily monitoring of the status of the stress test in the Quality Test Plan (QTP) and REALIS (Reliability Evaluation and Logistic Information System)• Verified and confirmation of abnormalities during stress tests and feedback to the counterparts within the cycle time.• Monitored, calculated and updated test start per month for Front End Product Qualification.• Reliability testing machines buy-off, preparation of buy-off reports and documentations within the given time frame.• Completed the business trip to Austria to learn the set-up and machine operation to prepare for a new product line qualification in Melaka Show less

• 

  Infineon Technologies

  Apr 2010 - Aug 2016

  Senior Project Leader

  Package development for Automotive Business Line leadframe and laminate packages (BGA, QFP, VQFN, TSSOP) from concept to design to implementation to volume production at inhouse and subcon production.Main responsibilities:• Engaged with business division in EU and factories (internal and subcon) in Asia in all aspects of the projects.• Led BE project team including Development, QM, Process, Testing, Production and Material Planning to ensure successful qualification and ramp up of the projects.• Control, monitor and report project progress to Top management and internal customers as well as presentation in Milestone Review Board for Milestones release.Key achievements:• Released successfully 28 development projects to production in fulfillment of quality/scope, time-to-market and cost.• Delivered new product development projects to ensure the fulfilment of packaging to achieve business divisions/customers' requirement within the given timeline.• Transferred successfully inhouse packages (BGAs) to subcon to ensure package cost competitiveness- activities including feasibility study, reliability assessment, qualification and ramp-up of the packages at subcon.• Setup systematic documentation to enable the ramp up projects.• Executed risk assessments with respect to all changes and new package / products introduction to reduce the overall project risks.• Engaged in customer audits internally and at subcon. Show less

• 

  NXP Semiconductors

  Sept 2016 - Jan 2017

  Industrial Project Manager
• 

  Nexperia

  Feb 2017 - now

  Within Nexperia Analog and Logic ICs Business Group, new products, wafer diffusion process and packages are developed to be used in automotive and commodity markets such as in mobile, automotive, computing, industrial and consuming with a large portfolio of products running in both internal and external factories in Asia. Main responsibilities:• Have a major role in the development and qualification of new products, new wafer fabs, new wafer diffusion processes and new/improved packages by defining qualification/reliability strategies and execution of qualifications to ensure timely and successful release of projects.• Part of the project core team and owner of quality & zero defect project gate deliverables, define safe launch plans, review and conclude on qualification results and final qual reports.• Part of Customer complaint handling team in driving timely root cause investigations, failure analysis and 8D reports generations to provide satisfied answers to customers.• Support customer interactions with quality and reliability expertise in relation to PCNs, PPAPs and other customer's questions.• Support customer audits and drive 8D-teams related to New product introductions with internal and external manufacturing sites. Show less Main responsibilities:• Led multifunctional and international teams from Europe and Asia with representatives from engineering, quality, product management, assembly and test while responsible for project initiation, planning, execution, monitoring and control and project close. • Define the project scope, timeline and own the business case and drive execution of projects to enable cost effective manufacturing solutions in wafer processes, assembly processes and packaging in internal factories as well as OSAT/foundriesKey achievements:• Delivered 6 and managed another 5 projects with total budget of more than $3M meeting the scope, cost and time.• Developed and qualified Au-to-Cu wire conversion projects, die compaction project, high density leadframe conversion project, transferring packages to subcon to enhance cost competitiveness resulting in savings of more than $2.5M/year and meeting the relevant quality requirements (zero delam, AEC-Q100/Q006).• Managed and released successfully highly challenging time-to-market project of new package in external manufacturing site to meet business demand of $1.2M/ýear as well as zero delam and AEC-Q100/Q006 quality requirement with crisis management during project execution.• Had a major role in enhancing cost leadership and value engineering in manufacturing of standard logic parts in internal and external factories with target of $1M savings/year. Show less

  • Principal Product Quality Engineer

    Sept 2021 - now

  • Principal Product Quality Engineer

    Sept 2019 - now

  • Industrial Project Manager

    Feb 2017 - Aug 2019