Education

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  Texas a&m university

  2021 - 2023

  Master of engineering - meng materials science and engineering 3.44/4

  •Developed computational Pb-Sn phase diagrams using various solution models in Mathematica.•Analyzed stress-strain curves and creep-rupture data using MATLAB to determine key mechanical properties.•Experienced with physical vapor deposition and film characterization techniques in lab sessions.

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  國立交通大學

  2016 - 2018

  Master of science - ms materials science and engineering 4.23/4.3

  The Advanced Packaging and Metallization LabAdvisor: Dr. Chih ChenResearch area: Cu/Cu direct bonding•Increased copper film bonding strength by 24% under shear test, improving Cu-to-Cu joint reliability for future applications.• Applied electroplating and electropolishing to fabricate highly oriented nanotwinned copper films for enhanced bonding.•Characterized microstructure using FIB and EBSD, revealing elimination of bonding interface through anisotropic grain… Show more The Advanced Packaging and Metallization LabAdvisor: Dr. Chih ChenResearch area: Cu/Cu direct bonding•Increased copper film bonding strength by 24% under shear test, improving Cu-to-Cu joint reliability for future applications.• Applied electroplating and electropolishing to fabricate highly oriented nanotwinned copper films for enhanced bonding.•Characterized microstructure using FIB and EBSD, revealing elimination of bonding interface through anisotropic grain growth.•Published 1 paper in international journals and presented research at 2 conference talks. Show less

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  國立交通大學

  2012 - 2016

  Bachelor of science - bs undergraduate honors program of nano science and engineering 3.7/4.3

  •Performed accelerated life test on flip-chip solder joints, monitoring electromigration behavior under varying resistance change.•Utilized SEM and EDS to analyze microstructure, identifying porous intermetallic compounds leading to failure.