Wang Jin-Yi

Experience

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  Taita Chemical Company

  Jun 2000 - Sept 2000

  Ｃhemical Engineer
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  SPIL

  Aug 2012 - Sept 2015

  Integrated Process Engineer

  * BOM List create and review* To assess TRA report and host a kick-0ff meeting with all assembly teams *Well know Flip chip key process and solder ball interaction* To lead process engineer to solve project issue* To host Qualcomm device NPI project* Well know Failure analysis item and theroy* To build Contrrol Plan and device FMEA in new project.*2015 May~ Sept., SPIL NPI flow standardization group- FCCSP member 1. To define NPI action and NPI flow for all SPIL business unit standard 2. NPI experiences shared and fan-out to other Business Uint. 3. To define PDA/IPP criteria with substrate vendor. Show less

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  Siliconware Precision Industries

  Sept 2012 - Feb 2013

  R &D Engineer

  1.Analysis Flux and solder ball material character and the reaction2.To Assess phase-in Qualcomm's product in SPIL, I in charge the process of solder ball placement3.To define the doping element which is anti-oxidation criteria in solder ball in SPIL.4. To develop new techiquic of TCFC (thermal compression flip chip)5. To study the reaction between solder bump with different composition the bump's stress profile

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  華邦電子股份有限公司

  May 2016 - Jun 2017

  SQE, senior engineer
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  群聯電子 PHISON Electronics

  Jul 2017 - Aug 2021

  SQE, senior engineer

  As a Senior IC & supplier quality Engineer

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  S-group of Foxconn

  Aug 2021 - Dec 2021

  Subcon managemt, section manager
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  QUALCOMM TECHNOLOGIES INTERNATIONAL, LTD.

  Dec 2021 - now

  Senior, IC package Process & manufacture Engineer