Daniel Tan

Experience

• 

  Morganfields

  Jul 2017 - Jan 2018

  Server

  I worked as a full-time waiter at Morganfield's Empire Subang after completing Cambridge A-Levels before enrolling into Monash University in February 2018.Here I was tasked by the manager to supervise other waitstaff and kitchen staff, handle stocktaking, customer complaints, and bank transactions.

• 

  ConnectDots Sdn Bhd

  Dec 2019 - Jan 2020

  Promoter

  Promoted various food and beverage products as a multilingual promotor at various outlets.

• 

  Sony EMCS Sdn Bhd

  Dec 2020 - Feb 2021

  Panel and Mechanical Design Intern

  During my internship, I conducted thermal testing on Sony's SEA 2022 LCD TV models and implemented solutions to reduce critical component temperatures. I also assisted in performing thermal simulations and wrote reports for meetings with upper management and engineering teams.I also gained experience performing detailed inspections and tests in the optical & mechanical departments for LCD TVs.

• 

  Intel Corporation

  Apr 2022 - Sept 2024

  Advanced Packaging Module Engineer

  I first joined Intel in 2022 as a Module Engineer under the Die Sort team for Intel’s new Advanced Packaging site in Penang. Initially stationed at Intel Kulim until mid-2023 for seeding, I led the Penang team as main tool owner for the die sort equipment and was responsible for installing and qualifying over 200 tools, managing the daily operations and developing process improvements to production tools, and troubleshooting issues that impacted uptime through data analysis. With my experience at Kulim, I took further responsibilities to develop the qualification plan for Die and Wafer Sort’s equipment for Penang’s startup to meet factory certification deadlines, managed the quarterly budgets as team cost representative, led the procurement of all the tools and items required for Die Sort's startup, designed new training programs and handbooks, and transferred and developed improvements to equipment and process parameters; all of which led to a promotion in 2024. Highlights include: - Reducing startup timeline by 1.5 months by streamlining activities using Lean principles. - Managing the procurement of over $300,000 worth of tools and items while saving over $90,000. - Certifying over 10 engineers and technicians in equipment processes, calibrations, operations, troubleshooting, and safety. - Installing over 200 die sort equipment at Intel’s Kulim site 1 month ahead of schedule. - Developing process improvements at Intel’s Kulim site, surpassing uptime goal of 97.5% by 1%. - Eliminating over 15 quality risk events using root cause analysis (RCA) and A3 problem solving. Show less